journal article·2020-08

Controlling βSn grain orientations in electronic interconnects with single-crystal Cobalt substrates

Z.L. Ma, C. Li, S.Y. Yang, X.W. Cheng

Acta Materialia· Volume 194
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Abstract

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Research context

OpenAlex topics: Electronic Packaging and Soldering Technologies · Intermetallics and Advanced Alloy Properties · Metallurgical and Alloy Processes

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