The crystallographic growth directions of Sn whiskers
Source abstract
Abstract
Abstract The growth directions of 55 Sn whiskers, i.e. the crystallographic orientation parallel to the whisker-growth axes, were determined using (i) a focused ion beam microscope for the determination of the physical growth angles of the whiskers with respect to a specimen (reference) coordinate system and (ii) an electron backscatter detector in a scanning electron microscope for the determination of the crystallographic orientation of the whiskers. The Sn whiskers were found to grow preferentially along low-index directions of the β-Sn crystal structure. The experimental findings of this study (and most of the results presented in the literature as well) were explained by applying, in a modified way, the Hartman–Perdok concept of periodic bond chains, i.e. chains of strong bonds running uninterruptedly through the structure, to the Sn whisker-growth phenomenon.
Source: openaire · Quality: candidate unverified · Source record ↗
Research context
OpenAlex topics: Electronic Packaging and Soldering Technologies · Aluminum Alloy Microstructure Properties · Surface and Thin Film Phenomena
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
References (56)
Show source-provided references
1. Compton · Corrosion · 1951 · 7 · 32710.5006/0010-9312-7.10.327 ↗
2. Galyon · IEEE Trans. Electron. Packag. Manuf. · 2005 · 28 · 9410.1109/TEPM.2005.847440 ↗
3. Donald · Met. Mater. Trans. · 2013 · 44A · 1485
4. Herring · Phys. Rev. · 1952 · 85 · 106010.1103/PhysRev.85.1060.2 ↗
5. Lee · Acta Mater. · 1998 · 46 · 370110.1016/S1359-6454(98)00045-7 ↗
6. Tu · J. Mater. Sci. – Mater. Electron. · 2007 · 18 · 26910.1007/s10854-006-9029-z ↗
7. Sobiech · Appl. Phys. Lett. · 2009 · 94 · 22190110.1063/1.3147864 ↗
8. Sobiech · Appl. Phys. Lett. · 2008 · 93 · 01190610.1063/1.2953973 ↗
9. Hasiguti · Acta Metall. · 1955 · 3 · 20010.1016/0001-6160(55)90094-8 ↗
10. Lindborg · Acta Metall. · 1976 · 24 · 18110.1016/0001-6160(76)90021-3 ↗
11. Choi · Acta Mater. · 2003 · 51 · 625310.1016/S1359-6454(03)00448-8 ↗
12. Williams · J. Electron. Mater. · 2007 · 36 · 21410.1007/s11664-006-0071-7 ↗
13. Sobiech · J. Mater. Res. · 2011 · 26 · 148210.1557/jmr.2011.162 ↗
14. Kumar · J. Mater. Res. · 2008 · 23 · 291610.1557/JMR.2008.0351 ↗
15. Chason · Appl. Phys. Lett. · 2008 · 92 · 17190110.1063/1.2912528 ↗
16. A.E. Pedigo, C.A. Handwerker, J.E. Blendell, Whiskers, hillocks, and film stress evolution in electroplated Sn and Sn-Cu films, in: Proc 58th Electron Comp & Technol Conf 2008, 1498.10.1109/ECTC.2008.4550174 ↗
17. Glazunova · Sov. Phys.-Crystallogr. · 1962 · 7 · 761
18. Moriuchi · J. Electron. Mater. · 2007 · 36 · 22010.1007/s11664-006-0030-3 ↗
19. Lin · J. Mater. Res. · 2007 · 22 · 197510.1557/jmr.2007.0232 ↗
20. Lin · J. Electron. Mater. · 2007 · 36 · 173210.1007/s11664-007-0284-4 ↗
21. B. Horvath, G. Harsanyi, Mechanical stress induced whiskers, in: 15th International Symposium for Design and Technology of Electronics Packages (SIITME 2009) 2009, 389.10.1109/SIITME.2009.5407337 ↗
22. Osenbach · IEEE Trans. Electron. Packag. Manuf. · 2007 · 30 · 2310.1109/TEPM.2006.890637 ↗
23. E.R. Crandall, G.T. Flowers, P. Lall, M.J. Bozack, Whisker growth under controlled humidity exposure, in: Proc 57th IEEE Holm Conf Electr Contacts 2011, 49.10.1109/HOLM.2011.6034780 ↗
24. Balazs · Surf. Coat. Technol. · 2010 · 205 · 226210.1016/j.surfcoat.2010.09.012 ↗
25. Suganuma · Acta Mater. · 2011 · 59 · 725510.1016/j.actamat.2011.08.017 ↗
26. Galyon · Global SMT Packaging · 2005 · 10
27. Smetana · IEEE Trans. Electron. Packag. Manuf. · 2007 · 30 · 1110.1109/TEPM.2006.890645 ↗
28. Coble · J. Appl. Phys. · 1963 · 34 · 167910.1063/1.1702656 ↗
29. Sobiech · J. Electron. Mater. · 2011 · 40 · 230010.1007/s11664-011-1737-3 ↗
30. K. Whitlaw, J. Crosby, An investigation into methods for minimising tin whisker growth, in: Proc AESF SUR/FIN Conf 2003, 289.
31. Britton · Trans. Inst. Metal Finish. · 1974 · 52 · 9510.1080/00202967.1974.11870313 ↗
32. Xu · Circuit Tree · 2002 · 15 · 10
33. M. Sobiech, U. Welzel, R. Schuster, E.J. Mittemeijer, W. Huegel, A. Seekamp, V. Mueller, The microstructure and state of stress of Sn thin films after post-plating annealing: An explanation for the suppression of whisker formation? in: Proc IEEE 57th Electro Comp & Technol Conf 2007, 192.10.1109/ECTC.2007.373797 ↗
34. Osenbach · IEEE Trans. Electron. Packag. Manuf. · 2005 · 28 · 3610.1109/TEPM.2005.847438 ↗
35. Baated · J. Electron. Mater. · 2011 · 40 · 227810.1007/s11664-011-1712-z ↗
36. R. Schetty, W. Sepp, Minimization of tin whisker growth for ultra-low tin whisker applications, in: Proc 11th Electron Packag Technol Conf 2009, 225.10.1109/EPTC.2009.5416547 ↗
37. Jadhav · J. Electron. Mater. · 2013 · 42 · 31210.1007/s11664-012-2267-3 ↗
38. Stein · J. Electron. Mater. · 2014 · 43 · 430810.1007/s11664-014-3328-6 ↗
39. Glazunova · Zhurnal Prikladnoi Khimii · 1961 · 36 · 543
40. NASA, Whisker Failures: http://nepp.nasa.gov/whisker/failures/index.htm.
41. Michael · Microsc. Microanal. · 2012 · 18 · 87610.1017/S143192761200044X ↗
42. Susan · 2012
43. Hartmann · Acta Crystallogr. · 1955 · 8 · 4910.1107/S0365110X55000121 ↗
44. Hartmann · Acta Crystallogr. · 1955 · 8 · 52110.1107/S0365110X55001679 ↗
45. Jadhav · JOM · 2010 · 62 · 3010.1007/s11837-010-0105-8 ↗
46. Stein · J. Appl. Crystallogr. · 2013 · 46 · 164510.1107/S0021889813024527 ↗
47. F.R.N. Nabarro, P.J. Jackson, Growth and perfection of crystals, in: Proc. Int. Conf. Crystal Growth, John Wiley & Sons, New York, 1958.
48. Treuting · Acta Metall. · 1957 · 5 · 59810.1016/0001-6160(57)90128-1 ↗
49. Smith · J. Appl. Phys. · 1958 · 29 · 67910.1063/1.1723249 ↗
50. Ellis · 1958
51. Ellis · Trans. Met. Soc. AIME · 1966 · 236 · 872
52. Morris · Scripta Mater. · 1974 · 8 · 23110.1016/0036-9748(74)90244-0 ↗
53. Hutchinson · Mater. Sci. Forum · 2004 · 467–470 · 467
54. Frye · IEEE Trans. Electron. Packag. Manuf. · 2007 · 30 · 210.1109/TEPM.2007.891763 ↗
55. Chiu · Scripta Mater. · 2009 · 60 · 112110.1016/j.scriptamat.2009.02.061 ↗
56. Schmid · 1935