On-chip laboratory suite for testing of free-standing metal film mechanical properties, Part II – Experiments

Abstract In this paper, we demonstrate the fabrication of electrostatically loaded, free-standing Al–0.5 wt.%Cu thin-film samples, realizing a near-zero compliance support post. We measure Young’s modulus E = 74 GPa using cantilevers, in good agreement with grain texture measurements. We measure residual stress σR ranging from 30 to 60 MPa using fixed–fixed beams and find that processing induces significant plastic straining, which leads to residual stress values significantly less than the as-deposited value. Strength of this alloy is at least 172 MPa if the film is not severely strained, and the material exhibits no room-temperature fatigue up to 1 billion cycles at this stress level. Notched devices that have been subjected to process-induced plastic straining of ∼4% are weaker and fatigue logarithmically with the number of cycles. We compare deformation processes on the samples using ex situ TEM. The mechanism for the high strength value is attributed to the grain size and the thin surface oxide which constrain dislocation glide, while fatigue of the highly strained material is associated with the appearance of persistent slip bands.