Driving forces for texture transformation in thin Ag films
Source abstract
Abstract
Abstract The well-known thickness-dependent (111)-to-(100) texture transformation in thin FCC films is usually attributed to a competition between interface and strain energies. In this model, thin films retain their (111) texture due to the lower energy of the (111) interface, while thick films transform to (100) due to the lower stiffness and thus strain energy of a (100) film. However, recent work has called this model into question, suggesting that neither the stress nor the interface energy play a dominant role in texture transformation. We investigated the driving forces involved in this transformation by using a bulge test apparatus to induce different stresses in thin Ag films under identical annealing conditions. In situ synchrotron XRD measurements show the change in texture during annealing, and reveal that applied stresses have no effect on the transformation. Stress analysis shows that differences in driving forces for texture transformation due to applied bulge pressure were significant (≈200 kJ/m 3 ), suggesting that a different, much larger driving force must be responsible. Reduction in defect energy has been proposed as an alternative. However, vacancy and dislocation densities must be exceptionally high to significantly exceed the strain energy and do not provide obvious orientation selection mechanisms. Nanotwins in reported densities are shown to provide greater driving force (≈1000 kJ/m 3 ) and may account for orientation selection. The large difference between the calculated strain and defect energies and the driving force for grain growth (21,100 kJ/m 3 ) casts doubt on the applicability of a simple thermodynamic model of texture transformation.
Source: openaire · Quality: candidate unverified · Source record ↗
Research context
OpenAlex topics: Copper Interconnects and Reliability · Magnetic properties of thin films · ZnO doping and properties
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
References (43)
Show source-provided references
1. The STM view of the initial stages of polycrystalline Ag film formation10.1088/1367-2630/9/3/074 ↗
2. Competition between strain and interface energy during epitaxial grain growth in Ag films on Ni(001)10.1557/JMR.1994.2411 ↗
3. Effects of barrier layer and annealing on abnormal grain growth in copper thin films10.1063/1.357283 ↗
4. Structure and annealing behavior of metal films deposited on substrates near 80K: I. Copper films on glass10.1116/1.1492398 ↗
5. Room-temperature recrystallization in thick bias-sputtered copper deposits10.1063/1.1659782 ↗
6. Columnar grains and twins in high-purity sputter-deposited copper10.1116/1.1312763 ↗
7. Formation of copper thin films by a low kinetic energy particle process10.1149/1.2085721 ↗
8. The influence of strain energy on abnormal grain growth in copper thin films10.1063/1.114455 ↗
9. The effects of processing on the microstructure of copper thin films on tantalum barrier layers10.1557/PROC-391-303 ↗
10. Growth of giant grains in silver thin films10.1016/S1359-6462(99)00205-5 ↗
11. Abnormal growth of giant grains in silver thin films10.1016/S1359-6454(00)00372-4 ↗
12. Effects of crystallographic texture on stress-migration resistance in copper thin films10.1063/1.1498495 ↗
13. Texture transition in copper thin films: Electron backscatter diffraction vs. x-ray diffraction10.1016/j.actamat.2006.03.057 ↗
14. Increasing the mean grain size in copper films and features10.1557/JMR.2008.0080 ↗
15. Kinetics and driving forces of abnormal grain growth in thin Cu films10.1016/j.actamat.2011.12.030 ↗
16. Effect of thickness and Ti interlayers on stresses and texture transformation in thin Ag films during thermal cycling10.1063/1.4829364 ↗
17. Texture transformations in Ag thin films10.1016/j.actamat.2013.07.061 ↗
18. Texture development in polycrystalline thin films10.1016/0921-5107(95)03011-5 ↗
19. Texture evolution during processing of polycrystalline films10.1146/annurev.matsci.30.1.159 ↗
20. Six-circle diffractometer with atmosphere-and temperature-controlled sample stage and area and line detectors for use in the G2 experimental station at CHESS10.1063/1.2372730 ↗
21. Mongkolsuttirat · 2013
22. A new bulge test technique for the determination of Young's modulus and Poisson's ratio of thin films10.1557/JMR.1992.3242 ↗
23. Plane-strain bulge test for thin films10.1557/jmr.2005.0313 ↗
24. Elastic constants of silver and gold10.1103/PhysRev.111.707 ↗
25. Analysis of the accuracy of the bulge test in determining the mechanical properties of thin films10.1557/JMR.1992.1553 ↗
26. Grain-growth and stress relief in thin-films10.1116/1.1316674 ↗
27. Fransila · 2010
28. Massive stress changes in plasma-enhanced chemical vapor deposited Silicon nitride films on thermal cycling10.1016/j.tsf.2004.01.047 ↗
29. Ashby · 2012
30. S.P. Baker, E.A. Ellis. In progress.
31. S. Dorokhov, K. Visser, S.P. Baker. In progress.
32. Temperature dependence of thermal expansion coefficient of silver nanoparticles and bulk material determined by EXAFS10.1107/S0909049500016666 ↗
33. Kinetics of phase change, I: General theory
34. Humphreys · 2004
35. Effect of deposition rate on the microstructure of electron beam evaporated nanocrystalline palladium thin films10.1016/j.tsf.2013.05.083 ↗
36. Situ Deformation of Thin Films on Substrates10.1002/jemt.20680 ↗
37. The dislocation density and twin-boundary frequency determined by X-ray peak profile analysis in cold rolled magnetron-sputter deposited nanotwinned copper10.1063/1.3622333 ↗
38. Diffraction Line Broadening Analysis if Broadening Is Caused by Both Dislocations and Limited Crystallite Size10.6028/jres.109.005 ↗
39. Vacancy formation during vapor deposition10.1016/S1359-6454(97)00156-0 ↗
40. Monovacancy formation energy in copper, silver, and gold by positron annihilation10.1007/BF00883748 ↗
41. Measurement of the equilibrium concentration of lattice vacancies near the melting point10.1103/PhysRev.119.600 ↗
42. High-strength, epitaxial nanotwinned Ag films10.1016/j.actamat.2010.09.011 ↗
43. Stress and grain growth in thin films10.1016/0022-5096(96)00022-1 ↗