journal article·2011-01

The formation of stacking fault tetrahedra in Al and CuIII. Growth by expanding ledges

H. Wang, D.S. Xu, R. Yang, P. Veyssière

Acta Materialia· Volume 59· Issue 1
Publisher page

Abstract

Ledge expansion and the concomitant growth of a stacking fault tetrahedron (SFT) are investigated in Al and Cu by molecular dynamics (MD) simulations by addition of vacancy rods with selected lengths Ledge expansion is largely governed by the site preference of vacancies on the SFT edges resulting in distinct stable ledged SFTs Both edge- and corner-facing ledge configurations may be adopted The growth of SFTs, especially large ones, is controlled by thermal agitation The mobile part of the ledges consists of a dipole of Shockley partials generally oriented in the 60 degrees mixed orientation that move in a thermally activated manner, reflecting a certain core reorganization of the Shockley dipole (C) 2010 Acta Materialia Inc Published by Elsevier Ltd All rights reserved
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Research context

OpenAlex topics: Microstructure and mechanical properties · Aluminum Alloy Microstructure Properties · Ion-surface interactions and analysis

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