ADHESIVE RESIN FOR MULTI-LAYER FILMS USED FOR SHRINK OR THERMOFORMING PROCESSES

Tie layers and other multilayer technology have made possible the combination of gas barrier polymers, e.g., polyamide and ethylene vinyl alcohol (EVOH) films, and moisture barrier polymers, e.g., polyethylene (PE) and polypropylene (PP). The result is that these multilayer films are finding increasing use in packages such as pouches and containers. However, the thermoforming process for cups or trays and the orientation process for shrink films can significantly reduce adhesion strength and often cause delamination of multilayered films. By combining graft and polymer blending technology, a new generation of tie layer adhesives has been developed to maintain high adhesion strength after thermoforming or orientation processes.