Thermal stability of Cu–Nb microcomposite wires
Source abstract
Abstract
Abstract We studied the thermal stability of Cu–Nb microcomposite wires with Cu–Nb interface density up to 21.6 μm 2 /μm 3 . This high density interface results in high hardness values. Annealing up to 500 °C caused no significant changes in interface density or grain size, and hardness values. At temperatures higher than 500 °C, however, hardness decreased rapidly. The higher the deformation strain, the more rapid the decreases in hardness. Differential scanning calorimetry showed a significant increment in heat flow above 500 °C, which is related to drop in crystallographic lattice distortion. Because of the high-density of interfaces between Cu and Nb, stress relaxation and recovery in Cu matrix are delayed compared to pure Cu. We observed pronounced grain growth and lattice distortion relaxation after annealing at 800 °C, but found neither precipitation nor detectable solid solution during the fabrication and annealing process.
Source: openaire · Quality: candidate unverified · Source record ↗
Research context
OpenAlex topics: Microstructure and mechanical properties · Aluminum Alloys Composites Properties · Advanced materials and composites
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