journal article·2011-02

Microstructure evolution of Cu/Ag interface in the Cu–6 wt.% Ag filamentary nanocomposite

J.B. Liu, L. Zhang, D.W. Yao, L. Meng

Acta Materialia· Volume 59· Issue 3
Publisher page

Abstract

Abstract A Cu–6 wt.% Ag filamentary nanocomposite was prepared by melting, aging and cold drawing. The changes in phase morphology and interface behavior in the preparation process were investigated. The Ag precipitates evolve into filaments during drawing deformation. The interface changes into coherence from semi-coherence if the filament diameter decreases to ∼2.0 nm during drawing deformation. The evolution of semi-coherent interface into coherent interface is analyzed on the basis of the minimum energy principle.
Source: openaire · Quality: candidate unverified · Source record ↗

Research context

OpenAlex topics: Microstructure and mechanical properties · Metal Forming Simulation Techniques · Electronic Packaging and Soldering Technologies

SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.

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