Length-scale-dependent cracking and buckling behaviors of nanostructured Cu/Cr multilayer films on compliant substrates
Source abstract
Abstract
Abstract Cu/Cr nanostructured multilayer films (NMFs) with modulation periods ( λ ) ranging from 250 nm to 10 nm and modulation ratios ( η ) ranging from 0.1 to 2.0 were prepared on flexible polyimide substrates by using magnetron sputtering. Upon uniaxial tensile testing, the critical cracking strain ( e c ), critical buckling strain ( e b ), and fracture toughness ( K IC ) of the NMFs were experimentally measured and all of the mechanical properties showed remarkable λ - and η -dependences. The cracking and buckling behaviors of the Cu/Cr NMFs were systematically investigated and both were found to depend strongly on the length scale. Based on an energy balance model, the interfacial adhesion energies ( Γ ) were determined using the measured buckle dimensions. Cracking maps and buckling maps were constructed from the experimental data to summarize the effects of λ and η on the cracking and buckling modes, respectively. In the cracking map, two regimes can be identified: one is brittle fracture with straight cracks and the other is ductile fracture with zigzag cracks. The ductile fracture regime is located in the region where λ ∼ 40 ± 20 nm and simultaneously η K IC ∼ 12.5 MPa m1/2. In the buckling map, four regimes are distinguished: cracked rectangular buckles, uncracked rectangular buckles, cracked triangular buckles, and uncracked triangular buckles. The effects of the length-scale-dependent deformation and adhesion energies on the buckling behaviors were discussed. A combined dimensionless parameter of K IC / E f Γ ( E f : elastic modulus of the NMF) was proposed to assess the buckling behaviors, and the K IC / E f Γ contours coincided well with the boundaries dividing the four buckling regimes.
Source: openaire · Quality: candidate unverified · Source record ↗
Research context
OpenAlex topics: Metal Forming Simulation Techniques · Metal and Thin Film Mechanics · Mechanical stress and fatigue analysis
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
References (90)
Show source-provided references
1. Fabrication of a cylindrical display by patterned assembly10.1126/science.1069153 ↗
2. Materials and mechanics for stretchable electronics10.1126/science.1182383 ↗
3. Paper-like electronic displays: large-area rubber-stamped plastic sheets of electronics and microencapsulated electrophoretic inks10.1073/pnas.091588098 ↗
4. Flexible solar cells for clothing10.1016/S1369-7021(06)71542-5 ↗
5. A large-area, flexible pressure sensor matrix with organic field-effect transistors for artificial skin applications10.1073/pnas.0401918101 ↗
6. Flexible ferroelectret field-effect transistor for large-area sensor skins and microphones10.1063/1.2335838 ↗
7. A stretchable form of single-crystal silicon for high-performance electronics on rubber substrates10.1126/science.1121401 ↗
8. Mechanics of precisely controlled thin film buckling on elastomeric substrate10.1063/1.2719027 ↗
9. Controlled buckling of semiconductor nanoribbons for stretchable electronics10.1038/nnano.2006.131 ↗
10. A hemispherical electronic eye camera based on compressible silicon optoelectronics10.1038/nature07113 ↗
11. Enhanced piezoelectricity and stretchability in energy harvesting devices fabricated from buckled PZT ribbons10.1021/nl104412b ↗
12. Internal stress, young’s modulus and adhesion energy of carbon films on glass substrates10.1016/0040-6090(81)90514-9 ↗
13. Adhesion energies of Cr thin films on polyimide determined from buckling: experiment and model10.1016/j.actamat.2010.06.032 ↗
14. Adhesion energy between metal films and polymers obtained by studying buckling induced by hydrogen10.1016/j.actamat.2003.12.003 ↗
15. From thin film and coating buckling structures to mechanical properties10.1016/j.msea.2006.09.181 ↗
16. Mixed mode cracking in layered materials
17. The characterization of telephone cord buckling of compressed thin films on substrates10.1016/S0022-5096(02)00034-0 ↗
18. Buckle delamination on patterned substrates10.1016/j.actamat.2004.03.014 ↗
19. Adhesion measurements using telephone cord buckles10.1016/j.msea.2006.08.027 ↗
20. Buckle morphology of compressed inorganic thin layers on a polymer substrate10.1016/j.tsf.2005.11.106 ↗
21. Experimental study on buckle evolution of thin inorganic layers on a polymer substrate10.1016/j.engfracmech.2010.07.012 ↗
22. Buckling and post-buckling of stressed straight-sided wrinkles: experimental AFM observations of bubbles formation and finite element simulations10.1016/j.actamat.2004.05.011 ↗
23. A buckling-based metrology for measuring the elastic moduli of polymeric thin films10.1038/nmat1175 ↗
24. Estimation of interfacial fracture toughness based on progressive edge delamination of a thin transparent coating on a polymer substrate10.1016/j.actamat.2010.01.023 ↗
25. The relationship between thin film fragmentation and buckle formation: synchrotron-based in situ studies and two-dimensional stress analysis10.1016/j.actamat.2008.11.023 ↗
26. Detailed modelling of delamination buckling of thin films under global tension10.1016/j.actamat.2013.01.014 ↗
27. In situ study of cracking and buckling of chromium films on PET substrates10.1007/s11340-010-9359-x ↗
28. Cohesive and adhesive failure of hard and brittle films on ductile metallic substrates: a film thickness size effect analysis of the model system hydrogenated diamond-like carbon (a-C:H) on Ti substrates10.1016/j.actamat.2014.09.044 ↗
29. Crack nucleation during mechanical fatigue in thin metal films on flexible substrates10.1016/j.actamat.2013.02.041 ↗
30. Ductility of thin metal films on polymer substrates modulated by interfacial adhesion10.1016/j.ijsolstr.2006.07.022 ↗
31. The effect of film thickness on the failure strain of polymer-supported metal films10.1016/j.actamat.2009.11.010 ↗
32. In situ studies on the cohesive properties of α- and β-Ta layers on polyimide substrates10.1016/j.actamat.2011.05.057 ↗
33. On the interface debond at the edge of a thin film on a thick substrate10.1016/S1359-6454(01)00421-9 ↗
34. Deformation behavior of thin copper films on deformable substrates10.1016/S1359-6454(01)00293-2 ↗
35. A map of competing buckling-driven failure modes of substrate-supported thin brittle films10.1016/j.tsf.2012.07.011 ↗
36. Observation of the failure mechanism for diamond-like carbon film on stainless steel under tensile loading10.1016/j.scriptamat.2007.07.042 ↗
37. Plastic folding of buckling structures10.1103/PhysRevLett.99.046101 ↗
38. Molecular dynamics simulations of buckling-induced plasticity10.1063/1.3033552 ↗
39. A stress relaxation mechanism through buckling-induced dislocations in thin films10.1063/1.3457225 ↗
40. An overview of interface-dominated deformation mechanisms in metallic multilayers10.1016/j.cossms.2010.09.002 ↗
41. A model for dislocation behavior during deformation of Al/Al3Sc (fcc/L12) metallic multilayers10.1016/S1359-6454(03)00127-7 ↗
42. Deformation and fracture in microlaminates10.1016/S0040-6090(96)08905-5 ↗
43. Review: effect of bimetal interface structure on the mechanical behavior of Cu–Nb fcc–bcc nanolayered composites10.1007/s10853-014-8342-9 ↗
44. Mesoscale investigations for the evolution of interfaces in plasticity10.1016/j.cossms.2014.12.003 ↗
45. Atomistic modeling of the interaction of glide dislocations with “weak” interfaces10.1016/j.actamat.2008.07.041 ↗
46. Length-scale-dependent deformation mechanisms in incoherent metallic multilayered composites10.1016/j.actamat.2005.06.025 ↗
47. Length scale-dependent deformation behavior of nanolayered Cu/Zr micropillars10.1016/j.actamat.2011.12.001 ↗
48. Compressive flow behavior of Al–TiN multilayers at nanometer scale layer thickness10.1016/j.actamat.2011.02.036 ↗
49. Defect-interface interactions10.1016/j.pmatsci.2015.02.001 ↗
50. Length-scale-dependent deformation and fracture behavior of Cu/X (X=Nb, Zr) multilayers: the constraining effects of the ductile phase on the brittle phase10.1016/j.actamat.2011.08.016 ↗
51. Mechanical behavior of nanoscale Cu/PdSi multilayers10.1016/j.actamat.2013.04.047 ↗
52. Microstructure and strengthening mechanisms in Cu/Fe multilayers10.1016/j.actamat.2012.08.005 ↗
53. Mechanical properties of highly textured Cu/Ni multilayers10.1016/j.actamat.2010.11.057 ↗
54. Residual stresses in sputter-deposited copper/330 stainless steel multilayers10.1063/1.1813617 ↗
55. Residual stresses in polycrystalline Cu/Cr multilayered thin films10.1557/JMR.2000.0109 ↗
56. Measurements of stress during vapor deposition of copper and silver thin films and multilayers10.1063/1.363701 ↗
57. Freund · 2004
58. Scaling of the ductility with yield strength in nanostructured Cu/Cr multilayer films10.1016/j.scriptamat.2010.03.024 ↗
59. A maximum in ductility and fracture toughness in nanostructured Cu/Cr multilayer films10.1016/j.scriptamat.2009.10.030 ↗
60. Thickness dependent critical strain in submicron Cu films adherent to polymer substrate10.1063/1.2722684 ↗
61. Model for stress generated upon contact of neighboring islands on the surface of a substrate10.1063/1.1359437 ↗
62. Stresses in thin films: the relevance of grain boundaries and impurities10.1016/0040-6090(76)90453-3 ↗
63. Crystallite coalescence: a mechanism for intrinsic tensile stresses in thin films10.1557/JMR.1999.0468 ↗
64. Interfaces and stresses in thin films10.1016/S1359-6454(99)00286-4 ↗
65. Intrinsic stress in sputter-deposited thin films10.1080/10408439208244586 ↗
66. Fracture and delamination of chromium thin films on polymer substrates10.1007/s11661-009-9988-9 ↗
67. On the intrinsic stress in thin chromium films10.1016/0040-6090(86)90301-9 ↗
68. Internal stresses in sputtered chromium10.1016/0040-6090(77)90137-7 ↗
69. Evolution of tensile residual stress in thin metal films during energetic particle deposition10.1557/JMR.1999.0605 ↗
70. Tensile stress in hard metal films10.1063/1.1619561 ↗
71. Residual stresses and ion implantation effects in Cr thin films10.1016/S0168-583X(98)00780-0 ↗
72. Stress-related effects in thin films10.1016/0040-6090(89)90030-8 ↗
73. Stress and strain in polycrystalline thin films10.1016/j.tsf.2007.03.007 ↗
74. Residual strain and texture in free-standing nanoscale Cu-Nb multilayers10.1063/1.2794862 ↗
75. Interface stress development in the Cu/Ag nanostructured multilayered film during the tensile deformation10.1063/1.4903342 ↗
76. X-ray nanodiffraction reveals stress distribution across an indented multilayered CrN–Cr thin film10.1016/j.actamat.2014.11.011 ↗
77. Elastic buckling of AlN ribbons on elastomeric substrate10.1063/1.3081632 ↗
78. Buckling behaviors and adhesion energy of nanostructured Cu/X (X=Nb, Zr) multilayer films on a compliant substrate10.1016/j.actamat.2013.09.028 ↗
79. Cleavage due to dislocation confinement in layered materials10.1016/0022-5096(94)90076-0 ↗
80. Hertzberg · 1996
81. Plasticity contributions to interface adhesion in thin-film interconnect structures10.1557/JMR.2000.0395 ↗
82. Fracture mechanics of Ti/Al2O3 interfaces10.1016/0956-7151(93)90322-J ↗
83. Effects of diffusion on interfacial fracture of gold-chromium hybrid microcircuit films10.1023/A:1024979829573 ↗
84. Physics of adhesion10.1088/0034-4885/69/7/R03 ↗
85. Interfacial toughness measurements for thin films on substrates10.1016/S1359-6454(01)00354-8 ↗
86. Fracture behavior of diamond-like carbon films on stainless steel under a micro-tensile test condition10.1016/j.diamond.2005.07.002 ↗
87. An elevated temperature study of a Ti adhesion layer on polyimide10.1016/j.tsf.2013.01.016 ↗
88. Enhanced adhesion of atomic layer deposited titania on polycarbonate substrates10.1016/j.tsf.2006.08.022 ↗
89. A kinetic analysis of residual stress evolution in polycrystalline thin films10.1016/j.tsf.2012.11.001 ↗
90. Stress and microstructure evolution in thick sputtered films10.1016/j.actamat.2008.12.042 ↗