journal article·2010-10

Activated states for cross-slip at screw dislocation intersections in face-centered cubic nickel and copper via atomistic simulation

S.I. Rao, D.M. Dimiduk, J.A. El-Awady, T.A. Parthasarathy, M.D. Uchic, C. Woodward

Acta Materialia· Volume 58· Issue 17
Publisher page

Abstract

We extend our recent simulation studies where a screw dislocation in face-centered cubic (fcc) Ni was found to spontaneously attain a low energy partially cross-slipped configuration upon intersecting a forest dislocation. Using atomistic (molecular statics) simulations with embedded atom potentials, we evaluated the activation barrier for a dislocation to transform from fully residing on the glide plane to fully residing on a cross-slip plane intersecting a forest dislocation in both Ni and Cu. The activation energies were obtained by determining equilibrium configurations (energies) when variable pure tensile or compressive stresses were applied along the [1 1 1] direction on the partially cross-slipped state. We show that the activation energy is a factor of 2–5 lower than that for cross-slip in isolation via the Escaig process. The cross-slip activation energies obtained at the intersection in Cu were in reasonable accord with the experimentally determined cross-slip activation energy for Cu. Further, the activation barrier for cross-slip at these intersections was shown to be linearly proportional to (d/b)[ln( ffiffiffi 3 p d/b)] 1/2 , as in the Escaig process, where d is the Shockley partial dislocation spacing and b is the Burgers
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Research context

OpenAlex topics: Microstructure and mechanical properties · Metal and Thin Film Mechanics · Surface and Thin Film Phenomena

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