journal article·2013-08

Microstructure control of unidirectional growth of η-Cu6Sn5 in microbumps on 〈1 1 1〉 oriented and nanotwinned Cu

Han-wen Lin, Chia-ling Lu, Chien-min Liu, Chih Chen, Delphic Chen, Jui-Chao Kuo, K.N. Tu

Acta Materialia· Volume 61· Issue 13
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OpenAlex topics: Electronic Packaging and Soldering Technologies · 3D IC and TSV technologies · Aluminum Alloys Composites Properties

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