Experimental and numerical investigations on interface microstructure characteristics and wave formation mechanism of Sn/Cu explosive welded plates

The interface characteristics and formation mechanism of explosive welded waveform structures still lack a detailed and in-depth research. Thus, a combination of advanced characterization and numerical simulation methods were performed in this study to investigate the phase constitution, texture distribution, 3D interface morphology and wave formation mechanism of Sn/Cu explosive welded interface. The microstructure analyses indicated that the typical waveform structures composed of fine crystal band and elongated grains zone were formed at the Sn/Cu joining interface. The dynamic recrystallized structures and local high strain at the waveform were attributed to severe rheological deformation and rapid solidification of liquid metals. In addition, the S, copper, brass and fiber deformation textures and the cube and gross recrystallization textures were found. The CT results indicated the 3D Sn/Cu joining interface morphology presents a regular convex waveform feature, which is related to periodic pulse load caused by explosive detonation. Furthermore, based on the simulation results, the 2D joining interface presents similar experimental waveform structure, and the 3D interface evolution characteristic was consistent with the shock wave propagation characteristics on the flying plate to some extent, which was in good agreement with the experimental results.