Texture transition in Cu thin films: Electron backscatter diffraction vs. X-ray diffraction
Source abstract
Abstract
Abstract The microtexture of 0.5–10 μm thick Cu films on polyimide substrates was characterized by automated electron backscatter diffraction (EBSD). The transition from a dominant (1 1 1) to a (1 0 0) fibre texture with increasing film thickness is clearly evident and is in agreement with X-ray diffraction measurements. For interpretation of the texture evolution, a driving force map is constructed which displays the energy balance for interfacial and elastic driving forces using experimental yield stress values. The observations follow the predictions of the texture evolution model of Thompson and Carel [Thompson CV, Carel R. MSF 1996;204–206:83; Thompson CV, Carel R. J Mech Phys Solids 1996;44:657] but add new elements: the texture does not switch abruptly as predicted by energetic considerations, but a broad transition is found. Furthermore, access to the microtexture as well as grain size statistics is given by the EBSD technique, allowing new insight into the details of texture evolution.
Source: openaire · Quality: candidate unverified · Source record ↗
Research context
OpenAlex topics: Copper Interconnects and Reliability · Metal and Thin Film Mechanics · Microstructure and mechanical properties
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