Nucleation of tin on the Cu6Sn5 layer in electronic interconnections
Source abstract
Abstract
A Cu6Sn5 layer is an integral part of many electronic interconnections. Here we show that, although primary Cu6Sn5 is not a potent nucleant for Sn, the Cu6Sn5 layer plays a key role in Sn nucleation and microstructure formation in solder joints. Combining thermal analysis, FIB-tomography and EBSD, we show that conical cavities are present between the scallops of the Cu6Sn5 layer that act as geometric nucleation sites for Sn, that Sn grows from the Cu6Sn5 layer, and that reproducible nucleation orientation relationships (ORs) exist between Cu6Sn5 and Sn. With these ORs, a near-random distribution of Sn orientations is predicted from joint to joint even for Cu6Sn5 layers with a strong [0001] fibre texture. It is shown that the nucleation undercooling is strongly affected by manipulation of the Cu6Sn5 layer shape, and that it is possible to prevent nucleation on the Cu6Sn5 layer by adding more potent nucleants.
Source: openaire · Quality: candidate unverified · Source record ↗
Research context
OpenAlex topics: Electronic Packaging and Soldering Technologies · Aluminum Alloy Microstructure Properties · Aluminum Alloys Composites Properties
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
References (62)
Show source-provided references
1. Modelling of inoculation of metallic melts: application to grain refinement of aluminium by Al–Ti–B10.1016/S1359-6454(00)00094-X ↗
2. New studies of nucleation mechanisms in aluminium alloys: implications for grain refinement practice10.1179/mst.1998.14.5.394 ↗
3. Grain refinement of magnesium alloys10.1007/s11661-005-0030-6 ↗
4. The effect of carbide and nitride additions on the heterogeneous nucleation behavior of liquid iron10.1007/BF02642799 ↗
5. Nucleation in undercooled liquids10.1016/0025-5416(84)90206-4 ↗
6. Cyclic twin nucleation in tin-based solder alloys10.1016/j.actamat.2010.01.030 ↗
7. Dependence of Sn grain morphology of Sn-Ag-Cu solder on solidification temperature10.1007/s11664-011-1756-0 ↗
8. Sn-Ag-Cu solder joint microstructure and orientation evolution as a function of position and thermal cycles in ball grid arrays using orientation imaging microscopy10.1007/s11664-010-1348-4 ↗
9. The role of elastic and plastic anisotropy of Sn in recrystallization and damage evolution during thermal cycling in SAC305 solder joints10.1007/s11664-011-1811-x ↗
10. Effect of Sn grain orientation on electromigration degradation mechanism in high Sn-based Pb-free solders10.1063/1.2936996 ↗
11. The microstructure of Sn in near-eutectic Sn–Ag–Cu alloy solder joints and its role in thermomechanical fatigue10.1557/JMR.2004.0222 ↗
12. Nucleation control and thermal aging resistance of near-eutectic Sn-Ag-Cu-X solder joints by alloy design10.1007/s11664-009-0936-7 ↗
13. Effects of Ti addition to Sn-Ag and Sn-Cu solders10.1016/j.jallcom.2012.01.032 ↗
14. The nucleation of Sn in undercooled melts: the effect of metal impurities10.1007/s11837-014-1161-2 ↗
15. Characterization of solidification process in Sn-Cu alloys using an interrupted tests10.2320/jinstmet.72.804 ↗
16. Size and substrate effects upon undercooling of Pb-free solders10.1007/s11664-009-0966-1 ↗
17. Growth of Sn and intermetallic compounds in Sn-Ag-Cu solder10.1007/s11664-004-0083-0 ↗
18. Heterogeneous nucleation in the liquid-to-solid transformation in alloys
19. Solidification of ternary eutectic and near eutectic alloys in the Ag-Cu-Sn system10.1179/026708304X4330 ↗
20. Effect of sample size on the solidification temperature and microstructure of SnAgCu near eutectic alloys10.1557/JMR.2005.0361 ↗
21. Walleser · 2008
22. Undercooling, microstructures and hardness of Sn-rich Pb-free solders on Cu-xZn alloy under bump metallurgies10.2320/matertrans.M2009127 ↗
23. Undercooling and microhardness of Pb-free solders on various under bump metallurgies10.1557/jmr.2008.0133 ↗
24. Microstructure and in situ observations of undercooling for nucleation of β-Sn relevant to lead-free solder alloys10.1007/s11664-010-1080-0 ↗
25. Controlling bulk Cu6Sn5 nucleation in Sn0.7Cu/Cu joints with Al micro-alloying10.1007/s11664-015-4092-y ↗
26. Kinetics of heterogeneous nucleation10.1063/1.1747588 ↗
27. Nucleation-controlled solidification kinetics10.1007/BF02648944 ↗
28. Athermal heterogeneous nucleation of solidification10.1016/j.actamat.2005.02.028 ↗
29. 2015
30. Nucleation and growth of tin in Pb-free solder joints10.1007/s11837-015-1582-6 ↗
31. The redistribution of solute atoms during the solidification of metals10.1016/0001-6160(53)90126-6 ↗
32. A mathematical analysis of solute redistribution during solidification10.1139/p55-089 ↗
33. The Interdependence Theory: the relationship between grain formation and nucleant selection10.1016/j.actamat.2011.04.035 ↗
34. Solidification microstructures: a conceptual approach10.1016/0956-7151(94)90044-2 ↗
35. Effect of Ni on the formation and growth of primary Cu6Sn5 intermetallics in Sn-0.7 wt.%Cu solder pastes on Cu substrates during the soldering process10.1007/s11664-015-4121-x ↗
36. Heterogeneous nucleation of βSn on NiSn4, PdSn4 and PtSn410.1016/j.actamat.2014.02.044 ↗
37. Further observations on dendritic growth in metals10.1139/p52-047 ↗
38. The growth rate of dendrites in undercooled tin10.1007/BF02661581 ↗
39. Web-dendrite growth of single crystals of tin10.1016/0022-0248(67)90013-9 ↗
40. Improving the thermomechanical behavior of lead free solder joints by controlling the microstructure
41. The crystal orientation of β-Sn grains in Sn-Ag and Sn-Cu solders affected by their interfacial reactions with Cu and Ni(P) under bump metallurgy10.1007/s11664-009-0902-4 ↗
42. Crystal orientation of β-Sn grain in Ni(P)/Sn–0.5Cu/Cu and Ni(P)/Sn–1.8Ag/Cu joints10.1557/JMR.2010.0253 ↗
43. Solidification processes in the Sn-rich part of the SnCu system
44. Investigation on Sn grain number and crystal orientation in the Sn–Ag–Cu/Cu solder joints of different sizes10.1007/s10854-009-0042-x ↗
45. Dependence of SnAgCu solder joint properties on solder microstructure
46. Effects of cobalt on the nucleation and grain refinement of Sn-3Ag-0.5Cu solders10.1016/j.jallcom.2016.04.265 ↗
47. Dantzig · 2009
48. Dependence of crystal nucleation on prior liquid overheating by differential fast scanning calorimeter10.1063/1.4868002 ↗
49. Nucleation kinetics and solidification temperatures of SnAgCu interconnections during reflow process10.1109/TCAPT.2006.885946 ↗
50. Spectrum of heterogeneous nucleation modes in crystallization of Sn-0.7wt%Cu solder: experimental results versus theoretical model calculations10.1007/s10854-015-3516-z ↗
51. Heterogeneous nucleation of Cu6Sn5 in Sn-Cu-Al solders10.1016/j.jallcom.2014.08.251 ↗
52. Kinetics of the η-η' transformation in Cu6Sn510.1016/j.scriptamat.2011.07.058 ↗
53. The influence of Ni additions on the relative stability of η and ηʹ Cu6Sn510.1063/1.3310019 ↗
54. The superstructure of domain-twinned η'-Cu6Sn510.1107/S0108768194004052 ↗
55. A survey of superstructures in intermetallic NiAs-Ni2In-type phases10.1006/jssc.1995.1350 ↗
56. A new phase in stoichiometric Cu6Sn510.1016/j.actamat.2012.08.024 ↗
57. Cracking and phase stability in reaction layers between Sn-Cu-Ni solders and Cu substrates10.1007/s11837-009-0087-6 ↗
58. Crystallographic study of grain refinement in aluminum alloys using the edge-to-edge matching model10.1016/j.actamat.2004.11.037 ↗
59. Textured growth of Cu6Sn5 grains formed at a Sn3.5Ag/Cu interface10.1016/j.matlet.2011.08.014 ↗
60. Growth orientations and mechanical properties of Cu6Sn5 and (Cu,Ni)6Sn5 on poly-crystalline Cu10.1016/j.jallcom.2012.04.110 ↗
61. A simple model for grain refinement during solidification10.1016/0001-6160(75)90188-1 ↗
62. Enhanced heterogeneous nucleation in AZ91D alloy by intensive melt shearing10.1016/j.actamat.2009.06.052 ↗