journal article·2022-02-01

Surface metallization with Ni–Cu bimetal for ZTA by electroless plating

Han He, Yehua Jiang, Juanjian Ru, Rong Zhou, Yixin Hua

Composite Interfaces· Volume 29· Issue 2
Publisher page

Abstract

The surface metallization of zirconia-toughened alumina (ZTA) particles with Ni–Cu bimetallic coatings is performed by electroless plating assisted with choline chloride–ethylene glycol (ChCl-EG) ionic liquid. The possible reactions and deposition sequences of the plating process have been analyzed based on the micro-morphologies of the Ni–Cu coated ZTA (ZTA@Ni–Cu) particles obtained at different reaction stages. The roles of ChCl-EG additive, reaction temperature, and ZTA concentration on the surface morphology, coating thickness, and element content of the ZTA@Ni–Cu particles are also investigated. Results show that uniform cauliflower-characteristic Ni–Cu coatings are formed on ZTA surfaces with 35 g·L−1 ChCl-EG at 65°C. The coating thickness is about 26.9 μm, and the element contents of Cu and Ni are 38.1 at% and 61.9 at%, respectively. Besides, a schematic illustration about the fabrication of ZTA@Ni–Cu particles is proposed to elaborate the formation process of Ni–Cu coatings and the function mechanism of ChCl-EG additive.
Source: openalex_inverted_index · Quality: baseline

Research context

OpenAlex topics: Electrodeposition and Electroless Coatings · Lubricants and Their Additives · Corrosion Behavior and Inhibition

SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.

Affiliations

School of Material Science and Engineering, Kunming University of Science and Technology, Kunming, PR China

National & Local Joint Engineering Laboratory of Advanced Metal Solidification Forming and Equipment Technology, Kunming, PR China

Faculty of Metallurgical and Energy Engineering, Kunming University of Science and Technology, Kunming, PR China

Funding

National Natural Science Foundation of China

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