Surface metallization with Ni–Cu bimetal for ZTA by electroless plating
Source abstract
Abstract
The surface metallization of zirconia-toughened alumina (ZTA) particles with Ni–Cu bimetallic coatings is performed by electroless plating assisted with choline chloride–ethylene glycol (ChCl-EG) ionic liquid. The possible reactions and deposition sequences of the plating process have been analyzed based on the micro-morphologies of the Ni–Cu coated ZTA (ZTA@Ni–Cu) particles obtained at different reaction stages. The roles of ChCl-EG additive, reaction temperature, and ZTA concentration on the surface morphology, coating thickness, and element content of the ZTA@Ni–Cu particles are also investigated. Results show that uniform cauliflower-characteristic Ni–Cu coatings are formed on ZTA surfaces with 35 g·L−1 ChCl-EG at 65°C. The coating thickness is about 26.9 μm, and the element contents of Cu and Ni are 38.1 at% and 61.9 at%, respectively. Besides, a schematic illustration about the fabrication of ZTA@Ni–Cu particles is proposed to elaborate the formation process of Ni–Cu coatings and the function mechanism of ChCl-EG additive.
Source: openalex_inverted_index · Quality: baseline
Research context
OpenAlex topics: Electrodeposition and Electroless Coatings · Lubricants and Their Additives · Corrosion Behavior and Inhibition
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
Affiliations
School of Material Science and Engineering, Kunming University of Science and Technology, Kunming, PR China
National & Local Joint Engineering Laboratory of Advanced Metal Solidification Forming and Equipment Technology, Kunming, PR China
Faculty of Metallurgical and Energy Engineering, Kunming University of Science and Technology, Kunming, PR China
Funding
National Natural Science Foundation of China
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