Electron work function guided tailoring of (W4-x, Mx)C4 /doped Ni matrix interfacial bonding: Insights from first-principles calculations
Source abstract
Abstract
Heavy tungsten carbide (WC) may cause inhomogeneous distributions in WC-metal matrix composite hardfacing overlays, thus negatively affecting its performance as reinforcement. WC can be lightened by partially substituting W with lighter metals, e.g., Mo and Cr, while maintaining its strength. However, the bonding between modified WC and matrix metals such as nickel (a typical metal-matrix for overlays) is uncertain. This article reports a study on the interfacial bonding between (W 4-x , M x )C 4 ( M =Mo or Cr) and Ni matrix via first-principle calculations. Different atomic interactions i.e., metal-metal and metal-carbon interactions, at the interface were studied to understand the interfacial bonding through analyses of electron work function (EWF), electron localization function, electronic density of states, bond order, and net charge. It was demonstrated that the lighter (W 4-x , M x )C 4 carbides exhibit strong bonding with Ni, comparable to or even stronger than that of WC/Ni interface, and the interfacial bonding includes covalent, ionic and metallic bond components. It is demonstrated that the interfacial bonding can be tuned by doping elements in the Ni matrix with different EWFs, e.g., Mn, Cu, Au, Pt, and Se. Efforts have been made to verify a hypothesis that EWF is an indicator, which can be used to guide selecting effective dopants for tailoring the interfacial bond strength.
Source: openalex_inverted_index · Quality: baseline
Research context
OpenAlex topics: Advanced materials and composites · Semiconductor materials and interfaces · Metal and Thin Film Mechanics
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
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