Low contact resistivity and excellent thermal stability of p‐type YbMg0.8Zn1.2Sb2/Fe‐Sb junction for thermoelectric applications
Source abstract
Abstract
1-2-2 Zintl phase compound is a promising thermoelectric material and holds potential for thermoelectric applications. Currently, there are many reports on Zintl-phase thermoelectric materials with high zT values. However, studies on the contact materials for the Zintl phase compounds have seldom been reported. Herein, an ohmic contact is realized in the YbMg 0.8Zn 1.2Sb 2/Fe junction with a contact resistivity of less than 1 μΩ cm 2 . The microstructural analysis shows that the interface reaction layer is composed of a Fe-Sb alloy layer and a Sb-poor Zintl layer. After 400 h of annealing at 773 K, the contact resistivity increased to ∼5.69 μΩ cm 2 due to the increased thickness of the Sb-poor layer and the decreased Sb content in the Sb-poor layer. To suppress the diffusion of the Sb element, the Fe-Sb layer with the nominal composition of Fe 90Sb 10 is chosen as the contact material. Our results show that the junction of YbMg 0.8Zn 1.2Sb 2 /Fe-Sb exhibits an extremely low contact resistivity, an excellent thermal stability, and good mechanical properties.
Source: expertdata · Quality: candidate unverified · Source record ↗
Research context
OpenAlex topics: Advanced Thermoelectric Materials and Devices · Thermal properties of materials · Thermal Radiation and Cooling Technologies
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
References (41)
Show source-provided references
1. High-performance flat-panel solar thermoelectric generators with high thermal concentration10.1038/nmat3013 ↗
2. Enhancing the thermoelectric performance of Cu-Ni alloys by introducing carbon nanotubes
3. Powering the IoT revolution with heat10.1038/s41928-019-0276-4 ↗
4. Polymer based thermoelectric nanocomposite materials and devices: fabrication and characteristics10.1016/j.nanoen.2020.105186 ↗
5. Complex thermoelectric materials10.1038/nmat2090 ↗
6. High performance thermoelectric materials: progress and their applications10.1002/aenm.201701797 ↗
7. Compromise and synergy in high-efficiency thermoelectric materials10.1002/adma.201605884 ↗
8. Enhanced average thermoelectric figure of merit of the PbTe-SrTe-MnTe alloy10.1021/acsami.6b16060 ↗
9. Preparation and characterization of Te/Poly(3,4-ethylenedioxythiophene):poly(styrenesulfonate)/Cu7Te4 ternary composite films for flexible thermoelectric power generator10.1021/acsami.8b15252 ↗
10. Reliable n-type Mg3.2Sb1.5Bi0.49Te0.01/304 stainless steel junction for thermoelectric applications10.1016/j.actamat.2020.07.058 ↗
11. Low contact resistivity and interfacial behavior of p-type NbFeSb/Mo thermoelectric junction10.1021/acsami.9b02124 ↗
12. Recent progress and future challenges on thermoelectric Zintl materials10.1016/j.mtphys.2017.06.003 ↗
13. Balancing the anionic framework polarity for enhanced thermoelectric performance in YbMg2Sb2 Zintl compounds10.1016/j.jmat.2019.08.002 ↗
14. Enhanced thermoelectric performance of P-type CaMg2Bi1.98 and optimized CaAl2Si2-type Zintl phase module with equal cross-section area
15. Bonding properties of calcium gallium arsenide, Ca14GaAs11: a compound containing discrete GaAs4 tetrahedra and a hypervalent As3 polyatomic unit10.1021/ic00027a022 ↗
16. Zintl phases for thermoelectric devices10.1039/b702266b ↗
17. Realizing high conversion efficiency of Mg3Sb2-based thermoelectric materials10.1016/j.jpowsour.2019.01.022 ↗
18. The universal influence of contact resistance on the efficiency of a thermoelectric generator10.1007/s11664-015-3731-7 ↗
19. Molybdenum and tungsten oxide: high work function wide band gap contact materials for hole selective contacts of silicon solar cells10.1016/j.solmat.2015.05.031 ↗
20. Understanding of the contact of nanostructured thermoelectric n-type Bi2Te2.7Se0.3 legs for power generation applications10.1039/c3ta13456c ↗
21. Efficient and robust thermoelectric power generation device using hot-pressed metal contacts on nanostructured half-heusler alloys10.1007/s11664-016-4692-1 ↗
22. Bonding and interfacial reaction between Ni foil and n-type PbTe thermoelectric materials for thermoelectric module applications10.1007/s10853-013-7857-9 ↗
23. Ni barrier in Bi2Te3-based thermoelectric modules for reduced contact resistance and enhanced power generation properties10.1016/j.jallcom.2019.04.293 ↗
24. Electronic structures and stability of Ni/Bi2Te3 and Co/Bi2Te3 interfaces10.1088/0022-3727/43/11/115303 ↗
25. Current progress and future challenges in thermoelectric power generation: from materials to devices10.1016/j.actamat.2014.12.042 ↗
26. Direct contact resistance evaluation of thermoelectric legs10.1007/s11340-016-0131-8 ↗
27. Design of apparatus for Ni/Mg2Si and Ni/MnSi1.75 contact resistance determination for thermoelectric legs10.1007/s11664-013-2940-1 ↗
28. Microstructure contact studies for Skutterudite thermoelectric devices10.1111/j.1744-7402.2011.02703.x ↗
29. Skutterudite unicouple characterization for energy harvesting applications10.1002/aenm.201200503 ↗
30. On the Challenges of reducing contact resistances in thermoelectric generators based on half-heusler alloys10.1007/s11664-015-4156-z ↗
31. Maximizing the performance of n-type Mg3Bi2 based materials for room-temperature power generation and thermoelectric cooling
32. Demonstration of ultrahigh thermoelectric efficiency of∼ 7.3% in Mg3Sb2/MgAgSb module for low-temperature energy harvesting10.1016/j.joule.2021.03.017 ↗
33. Microstructural evolution of the interfacial layer in the Ti-Al/Yb0.6Co4Sb12 thermoelectric joints at high temperature10.1016/j.jallcom.2014.05.087 ↗
34. Development of low resistance electrical contacts for thermoelectric devices based on n-type PbTe and p-type TAGS-85 ((AgSbTe2)(0.15)(GeTe)(0.85))10.1088/0022-3727/42/1/015502 ↗
35. Low resistance ohmic contacts to Bi2Te3 using Ni and Co metallization10.1149/1.3385154 ↗
36. Improvement of electrical contact between TE material and Ni electrode interfaces by application of a buffer layer10.1007/s11664-012-2036-3 ↗
37. A general design strategy for thermoelectric interface materials in n-type Mg3Sb1.5Bi0.5 single leg used in TEGs10.1016/j.actamat.2021.117616 ↗
38. Sze · 2006
39. Electrode interface optimization advances conversion efficiency and stability of thermoelectric devices10.1038/s41467-020-16508-x ↗
40. IMC growth of Sn-3.5Ag/Cu system: combined chemical reaction and diffusion mechanisms10.1016/j.jallcom.2012.04.068 ↗
41. Thermal Expansion studies of selected high-temperature thermoelectric materials10.1007/s11664-009-0734-2 ↗