Solute influence in transitions from non-Arrhenius to stick-slip Arrhenius grain boundary migration
Source abstract
Abstract
Synthetic driving force based molecular dynamics simulations are used to evaluate the grain boundary velocities for an incoherent Σ3 [111] 60° {11 8 5} GB in elemental nickel and its copper-based alloys in the dilute limit. We examine the effects of temperature, solute content, and magnitude of the driving force on grain boundary velocity trends and their associated mechanisms. We observe that, for pure nickel and its copper alloys in the dilute limit at high driving forces, these special grain boundaries exhibit non-Arrhenius or anti-thermal migration behavior, where temperature and grain boundary velocity are inversely related. For lower driving forces, the increased copper content leads to stick-slip migration behavior and a likely transition from non-Arrhenius to Arrhenius temperature dependence. Interestingly, the ordered atomic motions are frustrated but unchanged by the solute content and stick-slip migration. While the results are generally consistent with the Cahn-Lücke-Stüwe (CLS) model, no solute drag is observed; rather, the solute effects are likely the result of solute pinning.
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Research context
OpenAlex topics: Microstructure and mechanical properties · Microstructure and Mechanical Properties of Steels · Hydrogen embrittlement and corrosion behaviors in metals
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
References (67)
Show source-provided references
1. Cryogenic indentation-induced grain growth in nanotwinned copper10.1016/j.scriptamat.2012.12.026 ↗
2. The role of copper twin boundaries in cryogenic indentation-induced grain growth10.1016/j.msea.2013.11.005 ↗
3. Rapid stress-driven grain coarsening in nanocrystalline Cu at ambient and cryogenic temperatures10.1063/1.2008377 ↗
4. The influence of time, temperature, and grain size on indentation creep in high-purity nanocrystalline and ultrafine grain copper10.1063/1.1828213 ↗
5. Cryogenic stress-driven grain growth observed via microcompression with in situ electron backscatter diffraction10.1007/s11837-020-04075-x ↗
6. Nanotwin stability in alloyed copper under ambient and cryo-temperature dependent deformation states10.1016/j.msea.2023.144866 ↗
7. Sutton · 1995
8. Trends in grain boundary mobility: survey of motion mechanisms10.1007/s11837-013-0801-2 ↗
9. Separating grain boundary migration mechanisms in molecular dynamics simulations10.1016/j.actamat.2015.10.021 ↗
10. The role of crystallography and the mechanisms associated with migration of incoherent twin grain boundaries10.1016/j.actamat.2017.04.016 ↗
11. Survey of computed grain boundary properties in face-centered cubic metals—II: grain boundary mobility10.1016/j.actamat.2009.04.015 ↗
12. Antithermal mobility in Σ7 and Σ9 grain boundaries caused by stick-slip stagnation of ordered atomic motions about Coincidence Site Lattice atoms10.1016/j.actamat.2018.09.033 ↗
13. Understanding the anomalous thermal behavior of Σ3 grain boundaries in a variety of FCC metals10.1016/j.scriptamat.2018.07.011 ↗
14. A classical equation that accounts for observations of non-Arrhenius and cryogenic grain boundary migration10.1038/s41524-022-00835-2 ↗
15. Exploration of the mechanisms of temperature-dependent grain boundary mobility: search for the common origin of ultrafast grain boundary motion10.1007/s10853-016-9944-1 ↗
16. Anti-thermal mobility in the Σ3 [111]60°{11 8 5} grain boundary in nickel: mechanism and computational considerations10.1016/j.scriptamat.2016.10.032 ↗
17. Phase equilibria and thermodynamics of binary copper systems with 3 d-metals. VI. Copper-nickel system10.1007/s11106-007-0073-x ↗
18. Self-consistent linear-muffin-tin-orbitals coherent-potential technique for bulk and surface calculations: Cu-Ni, Ag-Pd, and Au-Pt random alloys10.1103/PhysRevB.47.16532 ↗
19. On the miscibility gap of Cu-Ni system10.1016/j.actamat.2018.01.038 ↗
20. Grain boundary segregation and interdiffusion effects in nickel–copper alloys: an effective means to improve the thermal stability of nanocrystalline nickel10.1021/am2004587 ↗
21. Gottstein · 2010
22. Lejček · 2010
23. The impurity-drag effect in grain boundary motion10.1016/0001-6160(62)90092-5 ↗
24. On the theory of impurity controlled grain boundary motion10.1016/0001-6160(71)90041-1 ↗
25. Direct atomistic modeling of solute drag by moving grain boundaries10.1016/j.actamat.2020.07.052 ↗
26. Molecular dynamics study of solute pinning effects on grain boundary migration in the aluminum magnesium alloy system10.1007/s11661-016-3322-0 ↗
27. Direct quantification of solute effects on grain boundary motion by atomistic simulations10.1016/j.commatsci.2014.06.040 ↗
28. Adapted solute drag model for impurity-controlled grain boundary motion10.1557/jmr.2014.136 ↗
29. The effect of solute atoms on grain boundary migration: a solute pinning approach10.1007/s11661-013-1690-2 ↗
30. Survey of computed grain boundary properties in face-centered cubic metals: I. Grain boundary energy10.1016/j.actamat.2009.04.007 ↗
31. A systematic study of grain boundary segregation and grain boundary formation energy using a new copper–nickel embedded-atom potential10.1016/j.actamat.2019.06.027 ↗
32. Structures and energies of Σ 3 asymmetric tilt grain boundaries in copper and aluminium10.1080/14786430701255895 ↗
33. Asymmetric tilt grain boundary structure and energy in copper and aluminium10.1080/14786430701455321 ↗
34. Structural unit and faceting description of Σ3 asymmetric tilt grain boundaries10.1007/s10853-007-1626-6 ↗
35. Atomic simulations of twist grain boundary structures and deformation behaviors in aluminum10.1063/1.4975042 ↗
36. LAMMPS - a flexible simulation tool for particle-based materials modeling at the atomic, meso, and continuum scales10.1016/j.cpc.2021.108171 ↗
37. Visualization and analysis of atomistic simulation data with OVITO–the Open Visualization Tool10.1088/0965-0393/18/1/015012 ↗
38. Smallman · 2016
39. Massalski · 1993
40. Effect of composition on the stacking fault energy of copper-nickel alloys using molecular dynamics simulations10.1016/j.matpr.2020.07.737 ↗
41. Concentration-temperature superposition principle for grain boundary migration in Ni (Cu) bicrystals
42. Solid solution strengthening and softening due to collective nanocrystalline deformation physics10.1016/j.scriptamat.2014.03.006 ↗
43. Dynamics of edge dislocation in Cu–Ni solid solution alloys at atomic scale10.1016/j.ijplas.2020.102834 ↗
44. Efficient calculation of the ECO driving force for atomistic simulations of grain boundary motion10.1016/j.commatsci.2020.109774 ↗
45. Energy conserving orientational force for determining grain boundary mobility10.1088/0965-0393/23/2/025007 ↗
46. Computing the mobility of grain boundaries10.1038/nmat1559 ↗
47. Inference and uncertainty propagation of GB structure-property models: H diffusivity in [100]tilt GBs in Ni10.1016/j.actamat.2021.116967 ↗
48. Surface step effects on nanoindentation10.1103/PhysRevLett.87.165507 ↗
49. Simulated migration behavior of metastable Σ3 (11 8 5) incoherent twin grain boundaries10.1088/1757-899X/1249/1/012019 ↗
50. Driving force induced transition in thermal behavior of grain boundary migration in Ni
51. Atomistic simulations of dislocation mobility in Al, Ni and Al/Mg alloys10.1088/0965-0393/13/3/007 ↗
52. Insights into factors that affect non-Arrhenius migration of a simulated incoherent Σ3 grain boundary10.1016/j.actamat.2023.119210 ↗
53. Stick-slip behavior of grain boundaries studied by accelerated molecular dynamics10.1103/PhysRevB.75.224101 ↗
54. Anti-thermal behavior of materials10.1016/j.scriptamat.2015.02.011 ↗
55. Role of the mesoscale in migration kinetics of flat grain boundaries10.1103/PhysRevB.89.214110 ↗
56. Review: grain boundary faceting–roughening phenomena10.1007/s10853-015-9341-1 ↗
57. Effect of faceting on grain boundary motion in Zn10.1016/j.actamat.2008.02.014 ↗
58. Grain boundary faceting and abnormal grain growth in nickel10.1007/s11661-000-0040-3 ↗
59. Roughening transition of grain boundaries in metals and oxides10.1007/s10853-005-6502-7 ↗
60. Faceting of Σ3 and Σ9 grain boundaries in copper10.1023/A:1015174921561 ↗
61. How grain growth stops: a mechanism for grain-growth stagnation in pure materials10.1126/science.1187833 ↗
62. Atomistic migration mechanisms of atomically flat, stepped, and kinked grain boundaries10.1103/PhysRevB.94.165413 ↗
63. Faceting of low-angle< 1 0 0>tilt grain boundaries in aluminum10.1016/j.scriptamat.2007.02.010 ↗
64. Influence of orientation grain facets on the migration velocity of high-angle boundaries10.1063/1.5013769 ↗
65. Grain boundary interface roughening transition and its effect on grain boundary mobility for non-faceting boundaries10.1016/j.scriptamat.2007.07.045 ↗
66. The mechanism of stick-slip phenomenon during friction process at low temperature environment10.1063/1.5109474 ↗
67. Diffusive-to-ballistic transition in grain boundary motion studied by atomistic simulations10.1103/PhysRevB.84.214102 ↗