Wetting of AlN by moten Cu-8.6Zr-xTi ternary alloys at 1373 K
Source abstract
Abstract
Abstract The wetting of AlN by molten Cu-8.6Zr-xTi (x=0, 5, 7.5, and 10 at.%) ternary alloys was conducted by the modified sessile drop method at 1373 K under a high vacuum. AlN cannot be wetted by Cu-8.6Zr binary eutectic alloy even though the precipitation of zirconium nitride at interface, while the addition of Ti in Cu-Zr eutectic alloy upgraded the wettability significantly. Based on the thermodynamic analysis, the interfacial reaction sequence leads to the preferential precipitation of zirconium nitride, and thus a bilayer reaction layer (zirconium nitride bottom and titanium nitride upper) was formed at the interface in Cu-8.6Zr-xTi/AlN. The final wettability was determined by the wetting nature of the reaction product (titanium nitride and stoichiometry in it) and the adsorption of Ti addition at interface. The spreading dynamics were further influenced by the interfacial reaction sequence, and presented two stages, first corresponds to the precipitation of zirconium nitride, and then corresponds to the precipitation of titanium nitride.
Source: openaire · Quality: candidate unverified · Source record ↗
Research context
OpenAlex topics: Advanced ceramic materials synthesis · Aluminum Alloy Microstructure Properties · Aluminum Alloys Composites Properties
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
References (44)
Show source-provided references
1. The intrinsic thermal conductivity of AlN10.1016/0022-3697(87)90153-3 ↗
2. High-temperature creep and cavitation of polycrystalline aluminum nitride10.1111/j.1151-2916.1990.tb05247.x ↗
3. AlN capped annealing of Si implanted semi‐insulating GaAs10.1063/1.93236 ↗
4. An additive micromolding approach for the development of micromachined ceramic substrates for RF applications10.1109/JMEMS.2004.828737 ↗
5. Aluminum-nitride packages provide consistent performance
6. Advantages and new development of direct bond copper substrates10.1016/S0026-2714(02)00343-8 ↗
7. Gale · 2004
8. Eustathopoulos · 1999
9. Development of a ceramic-based composite for direct bonded copper substrate10.1016/j.ceramint.2017.01.049 ↗
10. Direct bonding of copper to aluminum nitride10.1016/0921-5093(96)10190-8 ↗
11. Some observations on the wetting and bonding of nitride ceramics10.1007/BF00584866 ↗
12. Comparative study of Ti and Cr adhesion to the AlN ceramic: Experiments and calculations10.1016/j.apsusc.2018.07.023 ↗
13. Reactions of Ti and Zr with AlN and Al2O310.1016/0956-7151(92)90266-H ↗
14. Joining of AlN with metals and alloys10.1016/S0955-2219(00)00037-6 ↗
15. Adhesion strength and nucleation thermodynamics of four metals (Al, Cu, Ti, Zr) on AlN substrates10.1016/j.apsusc.2015.08.243 ↗
16. Wettability and interfacial reactions for AlN/CuTi and AlN/SnTi systems10.1016/j.ceramint.2011.08.037 ↗
17. Thermodynamic and experimental study of Ti-Ag-Cu alloys10.1016/0925-8388(94)06026-6 ↗
18. Wettability of transparent YAG (Y3Al5O12) by molten Ag-Cu-Ti alloys10.1016/j.jeurceramsoc.2015.03.036 ↗
19. Reactive wetting behavior and mechanism of AlN ceramic by CuNi-Xwt%Ti active filler metal10.1016/j.ceramint.2019.10.150 ↗
20. The effect of silicon on the wettability and interfacial reaction in AlN/Cu alloy systems10.1016/j.mseb.2010.09.001 ↗
21. Wetting and interfacial reactivity in Ag-Zr/sintered AlN system10.1016/S1359-6462(02)00449-9 ↗
22. Reactive wetting of TA2 pure Ti and TC4 alloy by molten Al 4043 alloy at 873–973 K10.1016/j.vacuum.2017.08.034 ↗
23. Wetting and interfacial behavior of Sn-Ti alloys on zirconia10.1007/s10853-018-2829-8 ↗
24. Interfacial bonding, wettability and reactivity in metal/oxide systems
25. Binary phase diagram (CD-ROM)
26. Wetting of h-BN by molten Cu-8.8Zr-xTi ternary alloys at 1373 K10.1016/j.vacuum.2019.109147 ↗
27. Wetting of TiN by liquid copper
28. Massalski · 1990
29. Phase chemistry in the Ti-Si-N system: Thermochemical review with phase stability diagrams10.1557/JMR.1994.2362 ↗
30. First-principles study of Zr-N crystalline phase: phase stability, electronic and mechanical properties10.1039/C6RA27233A ↗
31. Thermodynamics of Ti in Cu-Ti alloy investigated by the EMF method10.1016/S0921-5093(99)00148-3 ↗
32. Model predictions for the enthalpy of formation of transition metal alloys II10.1016/0364-5916(83)90030-5 ↗
33. Wetting of titanium nitride and titanium carbide by liquid metals10.1016/1359-6454(95)00165-0 ↗
34. Experimental study of the influence of interfacial energies and reactivity on wetting in metal/oxide systems10.1007/BF02651601 ↗
35. Contribution to the study of reactive wetting in the CuTi/Al2O3 system10.1007/BF01124693 ↗
36. Lequeux · 1998 · 112
37. Interphase reactions of metallike nitrides with liquid metals10.1007/BF00801574 ↗
38. Adsorption and wettability in metal/ceramic systems10.1007/3-540-54367-8_35 ↗
39. Estimation of the surface tensions of binary liquid alloys10.1007/BF02655927 ↗
40. Wettability of SiO2 and oxidized SiC by aluminium10.1016/0921-5093(91)90542-U ↗
41. The effect of thermodynamic properties of Me–Ti (Me = In, Sn, Ga, Au, and Ge) melts on the wetting of the CaF2 substrate10.1007/s10853-009-4018-2 ↗
42. Characteristics of spreading dynamics for adsorption wetting at high temperatures10.1016/j.commatsci.2014.11.052 ↗
43. Chemical reaction-limited spreading: the triple line velocity versus contact angle relation10.1016/S1359-6454(02)00309-9 ↗
44. Chemical physics of colloid systems and interfaces