journal article·1999-09

A new investigation of copper's role in enhancing Al–Cu interconnect electromigration resistance from an atomistic view

X.-Y Liu, C.-L Liu, L.J Borucki

Acta Materialia· Volume 47· Issue 11
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Abstract

No abstract is available for this record. The assistant can identify its topic from the title, but cannot infer the study’s results.

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Research context

OpenAlex topics: Copper Interconnects and Reliability · Semiconductor materials and interfaces · Semiconductor materials and devices

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References (20)

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