Texture comparison between room temperature rolled and cryogenically rolled pure copper

Abstract Nowadays, due to their potential for superior mechanical properties, a considerable interest in bulk ultrafine grained metals exists. One of the possible formation methods for this ultrafine grained material is cryogenic rolling. In this work, the influence of cryogenic rolling on the texture and the microstructure of pure copper is investigated by electron backscatter diffraction (EBSD), both in the deformed and the annealed state. This is done by comparing cryogenically rolled copper with room temperature rolled copper, rolled to the same thickness reductions. A texture difference between the room temperature rolled and cryogenically rolled copper is seen in the deformed state, although the largest texture difference is observed after annealing. These texture differences are mainly attributed to the presence of shear bands in the microstructure of the cryogenically rolled copper. In order to obtain a better understanding of the influence of shear bands on the texture evolution, the grain orientations inside the shear bands are analyzed both experimentally and numerically by applying the visco plastic self-consistent (VPSC) model. A number of shear band specific orientations, which are not observed in the conventional rolling texture of fcc materials, could be identified both in the experimental observations and in the simulations.