journal article·1998-11

Effects of annealing and interlayers on the adhesion energy of copper thin films to SiO2/Si substrates

M.D. Kriese, N.R. Moody, W.W. Gerberich

Acta Materialia· Volume 46· Issue 18
Publisher page

Abstract

No abstract is available for this record. The assistant can identify its topic from the title, but cannot infer the study’s results.

Source: Not provided · Quality: missing

Research context

OpenAlex topics: Metal and Thin Film Mechanics · Copper Interconnects and Reliability · Advanced ceramic materials synthesis

SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.

References (36)

Show source-provided references
1. Russell · Thin Solid Films · 1995 · 262 · 15410.1016/0040-6090(94)05812-1 ↗
2. Bagchi · Thin Solid Films · 1996 · 286 · 20310.1016/S0040-6090(96)08551-3 ↗
3. Kriese · Mater. Res. Soc. Symp. · 1997 · 473 · 3910.1557/PROC-473-39 ↗
4. Chang · J. appl. Phys. · 1989 · 66 · 116310.1063/1.344454 ↗
5. Chae · J. Mater. Sci. · 1994 · 29 · 74910.1007/BF00445989 ↗
6. Kellock · Mater. Res. Symp. Proc. · 1989 · 153 · 39110.1557/PROC-153-391 ↗
7. LaFontaine · J. Mater. Res. · 1990 · 5 · 77610.1557/JMR.1990.0776 ↗
8. Evans · Mater. Sci. Engng · 1990 · A126 · 5310.1016/0921-5093(90)90113-H ↗
9. Evans · Acta metall. · 1992 · 40 · S29510.1016/0956-7151(92)90289-Q ↗
10. Evans · Mater. Sci. Engng · 1993 · A162 · 110.1016/0921-5093(90)90025-X ↗
11. Hong · Acta metall. · 1995 · 43 · 272110.1016/0956-7151(94)00457-S ↗
12. Hutchinson, J. W. and Suo, Z., in Advances in Applied Mechanics, ed. J. W. Hutchinson and T. Y. Hu. Academic Press, New York, 1992, p. 6310.1016/S0065-2156(08)70164-9 ↗
13. LaFontaine · Mater. Res. Soc. Symp. · 1991 · 203 · 16310.1557/PROC-203-163 ↗
14. Marshall · J. appl. Phys. · 1984 · 56 · 263210.1063/1.333794 ↗
15. Rossington · J. appl. Phys. · 1984 · 56 · 263910.1063/1.333795 ↗
16. Rosenfield · J. appl. Phys. · 1990 · 67 · 329110.1063/1.345363 ↗
17. Kriese, M. D., Moody, N. R. and Gerberich, W. W., J. Mater. Res., submitted for publication
18. Kriese, M. D., Moody, N. R. and Gerberich, W. W., J. Mater. Res., submitted for publication
19. Schneider, J. A., Guthrie, S. E., Kriese, M. D., Clift, W. M. and Moody, N. R., Mater. Sci. Engng A, submitted for publication
20. Evans · Int. J. Solids Struct. · 1984 · 20 · 45510.1016/0020-7683(84)90012-X ↗
21. Bahr · Acta mater. · 1997 · 45 · 516310.1016/S1359-6454(97)00180-8 ↗
22. Suo · Int. J. Fract. · 1990 · 43 · 110.1007/BF00018123 ↗
23. Roarke, R. J., Formulas for Stress and Strain, 4th edn. McGraw-Hill, New York, 1965
24. Stoney · Proc. R. Soc. Lond. · 1909 · A82 · 17210.1098/rspa.1909.0021 ↗
25. Nix · Metall. Trans. A · 1988 · 20A · 2217
26. Ohring, M., The Materials Science of Thin Films. Academic Press, New York, 199210.1016/B978-0-08-051118-4.50012-8 ↗
27. deBoer, M., Ph.D. dissertation, University of Minnesota, 1996
28. Wu · J. Mater. Res. · 1991 · 6 · 40710.1557/JMR.1991.0407 ↗
29. Oliver · J. Mater. Res. · 1992 · 7 · 56410.1557/JMR.1992.1564 ↗
30. Tsui · Mater. Res. Soc. Symp. · 1997 · 473 · 5710.1557/PROC-473-57 ↗
31. Sinha · Thin Solid Films · 1978 · 48 · 11710.1016/0040-6090(78)90337-1 ↗
32. Murakami, M., CRC Critical Reviews in Solid State and Materials Sciences, Vol. 11, 1984, p. 31710.1080/10408438308244622 ↗
33. Oh · Acta metall. · 1988 · 36 · 208310.1016/0001-6160(88)90310-0 ↗
34. Charalambides · J. appl. Mech. · 1989 · 56 · 7710.1115/1.3176069 ↗
35. Venkataraman · J. Mater. Res. · 1996 · 11 · 313310.1557/JMR.1996.0398 ↗
36. Blech, I. and Robles, S., Solid St. Technol., 1994, September, 75