Cu6Sn5 crystal growth mechanisms during solidification of electronic interconnections
Source abstract
Abstract
The growth mechanisms of primary CuSn are studied in Sn-Cu alloys and solder joints by combining EBSD, FIB-tomography and synchrotron radiography. With increasing cooling rate and Cu content, CuSn crystals developed from faceted hexagonal rods to grooved rods, in-plane branched faceted crystals and, finally, to nonfaceted dendrites. This range of growth morphologies has been rationalised into a kinetic microstructure map. CuSn hexagonal rods grew along [0001] bounded by {101¯0} facets and CuSn dendrites branched along <405> in the {101¯0} planes. The faceted to nonfaceted transition indicates a kinetic interface roughening transition and a gradual change in mechanism from lateral growth governed by anisotropic attachment kinetics to continuous growth governed by diffusion and curvature. Finally, it is shown that the full range of CuSn morphologies that grew for different composition and cooling rate combinations in bulk alloys can be engineered to grow in solder joints made with a single composition (Sn-0.7 wt%Cu/Cu) by altering the peak temperature and the cooling rate.
Source: openaire · Quality: candidate unverified · Source record ↗
Research context
OpenAlex topics: Electronic Packaging and Soldering Technologies · Aluminum Alloy Microstructure Properties · Solidification and crystal growth phenomena
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
References (47)
Show source-provided references
1. Interfacial reaction issues for lead-free electronic solders10.1007/s10854-006-9031-5 ↗
2. Nickel-Tin transient liquid phase bonding toward high-temperature operational power electronics in electrified vehicles10.1109/TPEL.2012.2212211 ↗
3. Kinetics of Ag3Sn growth in Ag–Sn–Ag system during transient liquid phase soldering process10.1016/j.actamat.2010.02.018 ↗
4. Three-dimensional (3D) microstructural characterization and quantification of reflow porosity in Sn-rich alloy/copper joints by X-ray tomography10.1016/j.matchar.2011.07.011 ↗
5. Full intermetallic joints for chip stacking by using thermal gradient bonding10.1016/j.actamat.2016.04.046 ↗
6. Extremely fast formation of CuSn intermetallic compounds in Cu/Sn/Cu system via a micro-resistance spot welding process10.1016/j.jallcom.2016.06.184 ↗
7. Influence of composition on the morphology of primary Cu6Sn5 in Sn-4Cu alloys10.1007/s11664-012-2222-3 ↗
8. Heterogeneous nucleation of Cu6Sn5 in Sn-Cu-Al solders10.1016/j.jallcom.2014.08.251 ↗
9. In situ study on growth behavior of Cu6Sn5 during solidification with an applied DC in RE-doped Sn-Cu solder alloys10.1007/s10854-014-2201-y ↗
10. In situ investigation of unidirectional solidification in Sn-0.7Cu and Sn-0.7Cu-0.06Ni10.1016/j.actamat.2011.03.028 ↗
11. Effects of intermetallic compounds on properties of Sn-Ag-Cu lead-free soldered joints10.1016/S0925-8388(02)01166-0 ↗
12. Hexagonal-rod growth mechanism and kinetics of the primary Cu6Sn5 phase in liquid Sn-based solder
13. The effect of Cu6Sn5 whisker precipitates in bulk 60Sn-40Pb solder10.1007/BF02655484 ↗
14. Copper substrate dissolution in eutectic Sn-Ag solder and its effect on microstructure10.1007/s11664-000-0015-6 ↗
15. Controlling bulk Cu6Sn5 nucleation in Sn0.7Cu/Cu joints with Al micro-alloying10.1007/s11664-015-4092-y ↗
16. Anisotropic mechanical properties of Cu6Sn5 and (Cu,Ni)6Sn510.1016/j.matlet.2012.07.018 ↗
17. Microstructural development and mechanical properties of hypereutectic Sn-Cu solder alloys10.1016/j.msea.2013.01.049 ↗
18. Microstructure of a lead-free composite solder produced by an in-situ process10.1007/s11664-002-0024-8 ↗
19. Three-dimensional placement rules of Cu6Sn5 textures formed on the (111)(Cu) and (001)(Cu) surfaces using electron backscattered diffraction10.1016/j.matdes.2016.01.037 ↗
20. Growth characteristics and formation mechanisms of Cu6Sn5 phase at the liquid-Sn0.7Cu/(111)Cu and liquid-Sn0.7Cu/(001)Cu joint interfaces10.1016/j.actamat.2015.11.034 ↗
21. Direct observation of stray crystal formation in unidirectional solidification of Sn–Bi alloy by X-ray imaging10.1016/j.jcrysgro.2003.09.052 ↗
22. Rapid Cu6Sn5 growth at liquid Sn/solid Cu interfaces10.1016/j.scriptamat.2014.11.039 ↗
23. Effect of Ni on the formation and growth of primary Cu6Sn5 intermetallics in Sn-0.7 wt.%Cu solder pastes on Cu substrates during the soldering process10.1007/s11664-015-4121-x ↗
24. Nucleation of tin on the Cu6Sn5 layer in electronic interconnections10.1016/j.actamat.2016.10.008 ↗
25. 2015
26. Improved X-ray powder diffraction data for the disordered η-Cu6Sn5 alloy phase10.4028/www.scientific.net/MSF.228-231.577 ↗
27. A survey of superstructures in intermetallic NiAs-Ni2In-type phases10.1006/jssc.1995.1350 ↗
28. Cracking and phase stability in reaction layers between Sn-Cu-Ni solders and Cu substrates10.1007/s11837-009-0087-6 ↗
29. Kinetics of the η-η' transformation in Cu6Sn510.1016/j.scriptamat.2011.07.058 ↗
30. Capillary equilibria of dislocated crystals10.1107/S0365110X51001690 ↗
31. Screw dislocation driven growth of nanomaterials10.1021/ar400003q ↗
32. Crystal growth and dislocations10.1080/00018735200101171 ↗
33. Observation of unimolecular growth steps on crystal surfaces10.1080/14786445008521781 ↗
34. Observation of spiral growth-steps in n-Paraffin single crystals in the electron microscope10.1038/167476a0 ↗
35. Spiral growth on carborundum crystal faces10.1038/167939a0 ↗
36. V.I. The growth of cadmium iodide crystals: I—dislocations and spiral growth10.1080/14786440108520968 ↗
37. Relationship between morphologies and orientations of Cu6Sn5 grains in Sn3.0Ag0.5Cu solder joints on different Cu pads10.1016/j.matchar.2013.12.006 ↗
38. Jackson · 1958 · 174
39. Thermodynamic analysis of the Pt–Sn system10.1016/j.jallcom.2006.11.027 ↗
40. Identifying close-packed planes in complex crystal structures10.1016/j.actamat.2010.01.046 ↗
41. Theory of crystal growth and interface motion in crystalline materials10.1016/0001-6160(60)90110-3 ↗
42. The molecular mechanism of solidification10.1016/0001-6160(64)90130-0 ↗
43. NiSn4 formation during the solidification of Sn–Ni alloys10.1016/j.intermet.2012.02.010 ↗
44. Size effect model on kinetics of interfacial reaction between Sn-xAg-yCu solders and Cu substrate10.1038/srep07117 ↗
45. Growth of η phase scallops and whiskers in liquid tin-solid copper reaction couples10.1007/s11837-001-0100-1 ↗
46. Isothermal ageing of SnAgCu solder alloys: three-dimensional morphometry analysis of microstructural evolution and its effects on mechanical response10.1007/s11664-014-3017-5 ↗
47. Growth behavior of Cu6Sn5 in Sn–6.5 Cu solders under DC considering trace Al: in situ observation10.1016/j.intermet.2014.11.010 ↗