journal article·2023-09

Enhanced strength-ductility synergy and mechanisms of heterostructured Ti6Al4V-Cu alloys produced by laser powder bed fusion

Kunmao Li, Junjie Yang, Yanliang Yi, Xiaochun Liu, Yujing Liu, Lai-Chang Zhang, Wencai Zhang, Wei Li, Dongchu Chen, Shengfeng Zhou

Acta Materialia· Volume 256
Publisher page

Abstract

Limited slip systems of α structure always play a major role in hindering strength-ductility synergy improvement of titanium (Ti) alloys. To overcome the strength-ductility trade-off of Ti alloys, heterostructure is introduced into Ti6Al4V- xCu ( x = 0, 1, 3, 5 wt.%) alloys produced by laser powder bed fusion (LPBF), and the formation mechanism and deformation behavior of heterostructures were investigated. The results showed that the monolithic α` in the LPBF-produced Ti6Al4V- xCu (wt%) alloys is decomposed into dual α and α" after heat treatment at 600–900 °C through α` → α + Ti 2 Cu → matastable phase → α + α". The multistage transformation of α` to α and α" is driven by thermal activation (temperature > 800 °C), Cu addition and rapid cooling of water quenching. The heterostructure with α and α" in the LPBF-produced Ti6Al4V-5Cu alloy after heat treatment at 800 °C results in high tensile strength (∼1.3 GPa) and large elongation (∼15%). The enhanced strength-ductility synergy is attributed to the decomposition of brittle α` and Ti 2 Cu, as well the soft-hard heterostructure of α" and α. Moreover, the deformation twins (DTs) in α" and the heterogeneous interfaces of α and α" can also improve the strength and ductility of the LPBF-produced Ti6Al4V- xCu alloys. These findings elucidate the influence of heterostructure (α and α") on strength and ductility, which is helpful for designing Ti alloys with excellent mechanical properties.
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Research context

OpenAlex topics: Additive Manufacturing Materials and Processes · Titanium Alloys Microstructure and Properties · High Entropy Alloys Studies

SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.

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