journal article·2003-04

Tensile behavior of free-standing gold films. Part I. Coarse-grained films

R.D. Emery, G.L. Povirk

Acta Materialia· Volume 51· Issue 7
Publisher page

Abstract

The room temperature mechanical behavior of free-standing, coarse-grained gold films (grain size greater than 1.5 μm) was investigated by uniaxial tensile testing. Use of different deposition conditions resulted in films with a variety of microstructures. In addition, some of the free-standing films were also subjected to high temperature anneals to further alter their microstructures. With the exception of low ductility, the mechanical behavior of the films was generally consistent with what would be expected from large-scale gold specimens having similar grain size.
Source: openaire · Quality: candidate unverified · Source record ↗

Research context

OpenAlex topics: Copper Interconnects and Reliability · Metal and Thin Film Mechanics · Adhesion, Friction, and Surface Interactions

SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.

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