A comparison between deuterium plasma induced blistering of tungsten surface and hillocks grown on tungsten thin film

Tungsten (W) film was prepared by magnetron sputtering, and the coarse crystalline W bulk was used as reference samples. All the samples were exposed to deuterium plasma with the exposure fluence of 1.67 × 10 ²⁴ D/m ². The films were annealed in-situ at 723 K during deposition and hillocks were found on all film surfaces. Focused ion beam analysis of the subsurface structure of hillocks provides data support for the growth mechanism of hillocks. The formation of hillocks suggested that the underlying force is released the intrinsic compressive stress caused by thermal cycling during the magnetron sputtering. After deuterium plasma exposure, the W bulk showed obvious stepped high-dome deuterium blisters. The micrographs revealed the microscopic morphology characteristics of deuterium blisters and hillocks, and analyzed the similarities and differences between hillocks and surface deuterium blisters. By comparing the growth mechanism of hillocks on the W film with the surface blistering on the W bulk, the stress growth model of deuterium blisters on the surface of coarse crystalline W bulk is proposed. This work provides a new perspective for the transverse stress model of deuterium-induced surface blistering.