Evaluation of Cu as an interlayer in Be/F82H diffusion bonds for ITER TBM

Abstract Copper has been investigated as a potential interlayer material for diffusion bonds between beryllium and Reduced Activation Ferritic/Martensitic (RAFM) steel. Utilizing Hot Isostatic Pressing (HIP), copper was directly bonded to a RAFM steel, F82H, at 650 °C, 700 °C, 750 °C, 800 °C and 850 °C, under 103 MPa for 2 h. Interdiffusion across the bonded interface was limited to 1 μm or less, even at the highest HIP’ing temperature. Through mechanical testing it was found that samples HIP’ed at 750 °C and above remain bonded up to 211 MPa under tensile loading, at which point ductile failure occurred in the bulk copper. As titanium will be used as a barrier layer to prevent the formation of brittle Be/Cu intermetallics, additional annealing studies were performed on copper samples coated with a titanium thin film to study Ti/Cu interdiffusion characteristics. Samples were heated to temperatures between 650 °C and 850 °C for 2 h in order to mimic the range of likely HIP temperatures. A correlation was drawn between HIP temperature and diffusion depth for use in determining the minimum Ti film thickness necessary to block diffusion in the Be/F82H joint.