Nickel-plating for active metal dissolution resistance in molten fluoride salts

Abstract Ni electroplating of Incoloy-800H was investigated with the goal of mitigating Cr dissolution from this alloy into molten 46.5%LiF–11.5%NaF–42%KF eutectic salt, commonly referred to as FLiNaK. Tests were conducted in graphite crucibles at a molten salt temperature of 850 °C. The crucible material graphite accelerates the corrosion process due to the large activity difference between the graphite and the alloy. For the purposes of providing a baseline for this study, un-plated Incoloy-800H and a nearly pure Ni-alloy, Ni-201 were also tested. Results indicate that Ni-plating has the potential to significantly improve the corrosion resistance of Incoloy-800H in molten fluoride salts. Diffusion of Cr from the alloy through the Ni-plating does occur and if the Ni-plating is thin enough this Cr eventually dissolves into the molten salt. The post-corrosion test microstructure of the Ni-plating, particularly void formation was also observed to depend on the plating thickness. Diffusion anneals in a helium environment of Ni-plated Incoloy-800H and an Fe–Ni–Cr model alloy were also investigated to understand Cr diffusion through the Ni-plating. Further enhancements in the efficacy of the Ni-plating as a protective barrier against Cr dissolution from the alloy into molten fluoride salts can be achieved by thermally forming a Cr 2 O 3 barrier film on the surface of the alloy prior to Ni electroplating.