journal article·1995-06

Ultrasonic leaky interface waves for composite-metal adhesive bond characterization

C. M. Scala, P. A. Doyle

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Abstract

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Research context

OpenAlex topics: Ultrasonics and Acoustic Wave Propagation · Non-Destructive Testing Techniques · Thermography and Photoacoustic Techniques

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References (16)

Show source-provided references
1. A. A. Baker, R. J. Chester, M. J. Davis, J. D. Roberts, and J. A. Retchford,Composites 24:511 (1993).10.1016/0010-4361(93)90021-Y ↗
2. R. M. J. Kemp, RAE Tech. Memo Mat./Str. 1080 (1986).
3. S. I. Rokhlin, M. H. Hefets, and M. Rosen,J. Appl. Phys. 52:2847 (1981).10.1063/1.329016 ↗
4. P. A. Doyle and C. M. Scala,J. Acoust. Soc. Am. 93:1385 (1993).10.1121/1.405425 ↗
5. W. W. Johnson,Bull Seism. Soc. Am. 60:1105 (1970).10.1785/BSSA0600010289 ↗
6. B. A. Auld,Acoustic Fields and Waves in Solids, Vol. 1, Appendix 3 (Wiley & Sons, New York, 1973).
7. C. M. Scala and P. A. Doyle,J. Acoust. Soc. Am. 85:1569 (1989).10.1121/1.397360 ↗
8. C. M. Scala and S. J. Bowles,Nondestr. Test. Australia 25:112 (1988).
9. D. R. Arnott, DSTO Aeronautical Research Laboratory, Private communication.
10. L. R. F. Rose,Wave Motion 6:359 (1984).10.1016/0165-2125(84)90038-6 ↗
11. D. A. Lee and D. M. Corbly,IEEE Trans. Sonics Ultrason. SU-24:206 (1977).10.1109/T-SU.1977.30930 ↗
12. S. I. Rokhlin and E. Segel,J. Mater. Sci. 20:3300 (1985).10.1007/BF00545198 ↗
13. S. G. Hong and F. J. Boerio,J. Adhesion 32:67 (1990).10.1080/00218469008030182 ↗
14. S. I. Rokhlin, inAdhesive Joints: Formation Characteristics and Testing, K. L. Mittal, ed. (Plenum, New York, 1984), p. 307.10.1007/978-1-4613-2749-3_20 ↗
15. H. F. Tiersten,J. Appl. Phys. 40:770 (1969).10.1063/1.1657463 ↗
16. R. A. Everett, Jr. and W. S. Johnson, inDelamination and Debonding of Materials, W. S. Johnson, ed., ASTM STP876, p. 267.