Application of Pencil Lead Break (PLB) Point Source in the Detection of Interfacial Defects in Adhesive Bonds
Source abstract
Abstract
Abstract The presence of kissing bonds (zero-thickness disbond) along the interface of an adhesive bond is highly detrimental to its strength and longevity. The detection of these kind of defects has previously been attempted using several techniques such as ultrasonic, infrared thermography, and X-ray spectroscopy, etc. This study aims to assess the effectiveness of pencil lead break (PLB) tests as a source in detecting the defects distributed along the interface of an adhesive bond. The defects were introduced artificially using polytetrafluoroethylene (PTFE) spray along one of the interfaces of the adhesive bond fabricated with aluminium plates bonded with an epoxy adhesive. Three different interfacial defect area percentages, 0%, 25% and 40% and three adhesive layer thicknesses (i.e., 0.1 mm, 0.25 mm, and 0.5 mm) were considered. The PLB tests were conducted, and the recorded signals were analysed to assess the variation of AE features with the defect area percentage and adhesive layer thicknesses. Different source-sensor location configurations were also considered. The 200 kHz-highpass component of the recorded signals was found to be sensitive to the presence of the interfacial defects. The duration above a chosen threshold was found to be the distinguishing factor between the different defective specimens. Of the different sensor-source configurations tried, the configurations with the PLB on the 0.5 mm side were seen to be sensitive to the presence of defects.
Source: crossref · Quality: baseline
Research context
OpenAlex topics: Ultrasonics and Acoustic Wave Propagation · Non-Destructive Testing Techniques · Structural Health Monitoring Techniques
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
References (20)
Show source-provided references
1. Kumar, R.L.V., Bhat, M.R., Murthy, C.R.L.: Some studies on evaluation of degradation in composite adhesive joints using ultrasonic techniques. Ultrasonics 53(6), 1150–1162 (2013). https://doi.org/10.1016/j.ultras.2013.01.01410.1016/j.ultras.2013.01.014 ↗
2. Rucka, M., Wojtczak, E., Lachowicz, J.: Detection of debonding in adhesive joints using Lamb wave propagation. MATEC Web Conf. 262, 10012 (2019). https://doi.org/10.1051/matecconf/20192621001210.1051/matecconf/201926210012 ↗
3. Najib, M.F., Nobari, A.S.: Kissing bond detection in structural adhesive joints using nonlinear dynamic characteristics. Int. J. Adhes. Adhes. 63, 46–56 (2015). https://doi.org/10.1016/j.ijadhadh.2015.08.00410.1016/j.ijadhadh.2015.08.004 ↗
4. Droubi, M.G., Faisal, N.H., Orr, F., Steel, J.A., El-Shaib, M.: Acoustic emission method for defect detection and identification in carbon steel welded joints. J. Constr. Steel Res. 134, 28–37 (2017). https://doi.org/10.1016/j.jcsr.2017.03.01210.1016/j.jcsr.2017.03.012 ↗
5. Sause, M.: Investigation of pencil-lead breaks as acoustic emission sources. J. Acoust. Emiss. 29, 184–196 (2011)
6. Hamstad, M.A.: Acoustic emission signals generated by monopole (pencil-lead break) versus dipole sources: finite element modeling and experiments. J. Acoustic Emission 25, 92–106 (2007)
7. Zelenyak, A.M., Hamstad, M.A., Sause, M.G.R.: Modeling of acoustic emission signal propagation in waveguides. Sensors (Switzerland) 15(5), 11805–11822 (2015). https://doi.org/10.3390/s15051180510.3390/s150511805 ↗
8. Rokhlin, S.I.: Lamb wave interaction with lap-shear adhesive joints: theory and experiment. J. Acoust. Soc. Am. 89(6), 2758–2765 (1991). https://doi.org/10.1121/1.40071510.1121/1.400715 ↗
9. Marks, R., Clarke, A., Featherston, C., Paget, C., Pullin, R.: Lamb wave interaction with adhesively bonded stiffeners and disbonds using 3D vibrometry. Appl. Sci. (2016). https://doi.org/10.3390/app601001210.3390/app6010012 ↗
10. Ong, W.H., Rajic, N., Chiu, W.K., Rosalie, C.: Lamb wave–based detection of a controlled disbond in a lap joint. Struct. Heal. Monit. 17(3), 668–683 (2018). https://doi.org/10.1177/147592171771530210.1177/1475921717715302 ↗
11. K. Diamanti, J. M. Hodgkinson, and C. Soutis, Application of a lamb wave technique for the non-destructive inspection of composite structures. pp. 1–10.
12. Mustapha, S., Ye, L., Dong, X., Alamdari, M.M.: Evaluation of barely visible indentation damage (BVID) in CF/EP sandwich composites using guided wave signals. Mech. Syst. Signal Process. 76–77, 497–517 (2016). https://doi.org/10.1016/j.ymssp.2016.01.02310.1016/j.ymssp.2016.01.023 ↗
13. Rucka, M., Wojtczak, E., Lachowicz, J.: Damage imaging in lamb wave-based inspection of adhesive joints. Appl. Sci. (2018). https://doi.org/10.3390/app804052210.3390/app8040522 ↗
14. Mori, N., Wakabayashi, D., Hayashi, T.: Tangential bond stiffness evaluation of adhesive lap joints by spectral interference of the low-frequency A0 lamb wave. Int. J. Adhes. Adhes. 113, 103071 (2022). https://doi.org/10.1016/j.ijadhadh.2021.10307110.1016/j.ijadhadh.2021.103071 ↗
15. A.K. Prathuru, Structural and residual strength analysis of metal-to-metal adhesively bonded joints. Robert Gordon University [online], PhD thesis, 2019. Available from: https://rgu-repository.worktribe.com/output/346900
16. ASTM: E 976–99, Standard Guide for Determining the Reproducibility of Acoustic Emission Response, pp. 1–7, 2009.
17. Sause, M.G.R., Horn, S.: Simulation of acoustic emission in planar carbon fiber reinforced plastic specimens. J. Nondestruct. Eval. 29(2), 123–142 (2010). https://doi.org/10.1007/s10921-010-0071-710.1007/s10921-010-0071-7 ↗
18. Crawford, A., Droubi, M.G., Faisal, N.H.: Analysis of acoustic emission propagation in metal-to-metal adhesively bonded joints. J. Nondestruct. Eval. 37(2), 1–19 (2018). https://doi.org/10.1007/s10921-018-0488-y10.1007/s10921-018-0488-y ↗
19. Heller, K., Jacobs, L.J., Qu, J.: Characterization of adhesive bond properties using Lamb waves. NDT E Int. 33(8), 555–563 (2000). https://doi.org/10.1016/S0963-8695(00)00022-010.1016/S0963-8695(00)00022-0 ↗
20. Mai, A.K., Xu, P.C., Bar-Cohen, Y.: Leaky lamb waves for the ultrasonic nondestructive evaluation of adhesive bonds. J. Eng. Mater. Technol. Trans. ASME 112(3), 255–259 (1990). https://doi.org/10.1115/1.290331910.1115/1.2903319 ↗