Cross-sectional TEM study on Ni-mediated crystallization of amorphous silicon

Abstract Structural characteristics of polycrystalline silicon (poly-Si) made by Ni-mediated crystallization of amorphous silicon (a-Si) were investigated by cross-sectional transmission electron transmission (XTEM) according to various a-Si thickness. The Ni area density of ∼1014 cm−2 was deposited onto a-Si and it was annealed at 500 °C in the presence of an electric field of 10 V/cm. It is found that NiSi2 precipitates form at the top and bottom interfaces of a-Si during annealing. After reaching its critical size the crystallization proceeds from the top and bottom interfaces. The growth of needle-like Si crystallites has been seen, showing a migration of NiSi2 precipitates through the a-Si network. 1700 nm thick a-Si can be crystallized within 30 min which is longer than that (10 min) of 50 nm thick a-Si. However, the quality of 50 nm thick poly-Si is better than that of 300 nm or 1700 nm thick poly-Si.