journal article·1986-12

Passivation and VLSI packaging glasses with low flow points

Keiji Kobayashi

Journal of Non-Crystalline Solids· Volume 88· Issue 2-3
Publisher page

Abstract

No abstract is available for this record. The assistant can identify its topic from the title, but cannot infer the study’s results.

Source: Not provided · Quality: missing

Research context

OpenAlex topics: Semiconductor materials and devices · 3D IC and TSV technologies · Electrical and Thermal Properties of Materials

SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.

References (12)

Show source-provided references
1. Flowers · J. Electrochem. Soc. · 1981 · 128 · 217910.1149/1.2127213 ↗
2. Adams · J. Electroehem. Soc. · 1981 · 128 · 42310.1149/1.2127434 ↗
3. Berman · Solid St. Technol. · 1976 · 29
4. Armstrong · J. Electrochem. Soc. · 1974 · 121 · 30710.1149/1.2401803 ↗
5. Chen · 1983 · 83 · 43
6. Yamamoto · JPN Analyst. · 1965 · 14 · 69210.2116/bunsekikagaku.14.692 ↗
7. Kobayashi · J. Electrochem. Soc. · 1984 · 131 · 219010.1149/1.2116047 ↗
8. Götz · Phys. Chem. Glasses · 1977 · 18 · 32
9. Sack · Glastechn. Ber. · 1968 · 4 · 138
10. Physical Properties of Glass
11. Vleck · 1958 · 241
12. Snow · J. Appl. Phys. · 1966 · 37 · 212310.1063/1.1708747 ↗