Ink stamping lithography using polydimethylsiloxane stamp by surface energy modification

Abstract We studied a direct ink stamp (IS) process as a next generation patterning method using polydimethylsiloxane (PDMS) soft stamp and low viscosity ink resist. A propylene glycol monomethyl ether acetate (PGMEA) diluted novolak resist was used as an ink resist. The soft stamp and metal coated glass were treated by UV ozone to achieve hydrophilic surface. The process conditions such as the resist thickness on PDMS stamp, resist viscosity, surface energy of stamp and substrate were optimized in this work. A stripe pattern with 4.3 μm width Cr pattern was made.