journal article·2021-07Open access

On the ultimate resolution of As2S3-based inorganic resists

S.I. Nesterov, M.E. Boyko, M. Krbal, A.V. Kolobov

Abstract

Abstract The possibility of making lithographic masks based on As2S3 chalcogenide glass with ultimately small size of resist elements has been investigated. Interference lithography using synchrotron radiation with a wavelength of 13.4 nm, corresponding to extreme ultraviolet light, was used. High-quality masks with elements of 30 nm in size were obtained. In a dynamic light scattering study, resist particles of about 3 nm in size were found in the developer after the development process, which corresponds to the intermediate-range order parameter in the structure of the chalcogenide glass. It is assumed that this grain size determines the ultimate resolution, roughness and unevenness of the edge of the inorganic resist mask.
Source: openaire · Quality: candidate unverified · Source record ↗

Research context

OpenAlex topics: Phase-change materials and chalcogenides · Chalcogenide Semiconductor Thin Films · Nonlinear Optical Materials Studies

SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.

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