Thermally actuated a-SiC:H MEMS fabricated by a PECVD process
Source abstract
Abstract
Abstract The fabrication of a fully operational thermally actuated MEMS based on PECVD materials is reported. These micro-electro-mechanical systems consist of matrixes of free standing a-SiC:H and a-SiC:H/SiOxNy cantilevers actuated by thermal expansion induced by Joule effect. The structures’ motion is obtained by applying electrical voltage to heating elements integrated in the cantilevers and it is a consequence of the relaxation of the residual stress of a-SiC:H or results from the difference in the thermal expansion of a-SiC:H and SiOxNy. The mobile cantilevers are fabricated by front side bulk micromachining of c-Si substrates. Chromium metal is used as contact metal and heating element. The structures were characterized studying the obtained motion for different applied voltages/currents. The results show that up/down motion with amplitudes of ∼30 μm are obtained for heating currents of 22 mA. If voltage is applied in on/off cycles, up/down motion with frequencies up to 150 Hz is observed, but increasing frequency results in a reduction of the movement amplitude. Further, when the cantilevers are actuated in a synchronized way, ciliary motion is obtained.
Source: openaire · Quality: candidate unverified · Source record ↗
Research context
OpenAlex topics: Advanced MEMS and NEMS Technologies · Metal and Thin Film Mechanics · Diamond and Carbon-based Materials Research
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
References (17)
Show source-provided references
1. Muller · Microelectron. Eng. · 2000 · 53 · 4710.1016/S0167-9317(00)00264-1 ↗
2. Grayson · Adv. Drug Delivery Rev. · 2004 · 56 · 17310.1016/j.addr.2003.07.012 ↗
3. Nagel · Surf. Coat. Technol. · 1998 · 103&104 · 138
4. Bao · Sens. Actuat. A · 1996 · 56 · 13510.1016/0924-4247(96)01274-5 ↗
5. Alayo · Thin Solid Films · 1998 · 332 · 4010.1016/S0040-6090(98)01021-9 ↗
6. Carreño · Sens. Actuat. A · 2002 · 100 · 29510.1016/S0924-4247(02)00054-7 ↗
7. Pereyra · J. Non-Cryst. Solids · 1996 · 201 · 11010.1016/0022-3093(96)00131-7 ↗
8. Prado · J. Non-Cryst. Solids · 2001 · 283 · 110.1016/S0022-3093(01)00489-6 ↗
9. Lopes · J. Non-Cryst. Solids · 2004 · 338–340 · 78810.1016/j.jnoncrysol.2004.03.092 ↗
10. Carreño · J. Non-Cryst. Solids · 2004 · 338–340 · 49010.1016/j.jnoncrysol.2004.03.026 ↗
11. Rehder · Electrochem. Soc. Proc. · 2004 · 3 · 125
12. A.R. Oliveira, M.N.P. Carreño, J. Non-Cryst. Solids, in press, doi:10.1016/j.jnoncrysol.2006.01.075.10.1016/j.jnoncrysol.2006.01.075 ↗
13. Sarro · Sens. Actuat. A · 1998 · 67 · 17510.1016/S0924-4247(97)01730-5 ↗
14. Morgan · Ann. Rev. Mater. Sci. · 2000 · 30 · 64510.1146/annurev.matsci.30.1.645 ↗
15. Hintzen · J. Alloys Compd. · 2003 · 351 · 4010.1016/S0925-8388(02)01065-4 ↗
16. Mark A. Occhionero, Robert A. Hay, Richard W. Adams, Kevin P. Fennessy, IMAPS HDP and MCM’s, Denver, CO, 6–9 April 1999.
17. Giancoli · 2000