New substances for atomic-layer deposition of silicon dioxide
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OpenAlex topics: Semiconductor materials and devices · Catalytic Processes in Materials Science · Copper Interconnects and Reliability
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References (5)
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1. T. Suntola and M.J. Antson, US patent no. 4,058,430 (1977).
2. Gasser · Thin Solid Films · 1994 · 250 · 21910.1016/0040-6090(94)90188-0 ↗
3. Forbes · J. Am. Chem. Soc. · 1940 · 62 · 76110.1021/ja01861a019 ↗
4. Sugiura · 1993 · 513
5. Bensch · Semicond. Sci. Technol. · 1990 · 5 · 42110.1088/0268-1242/5/5/008 ↗