Application of surface tension in the design of novel Sn-Ag-Cu-based solders
Source abstract
Abstract
Surface tension is closely related to the wettability of solders, which is a crucial property for the design of Pb-free solders. However, the experimental surface tension data are scarce, especially for the multicomponent systems. In this paper, the surface tension of Sn-Ag-Cu (SAC) based ternary, quaternary and quinary alloys are predicted by various models and verified by experimental data. The calculated results by General Solution model (GSM) combined with binary experimental data are in best agreements with experimental values for most systems. For the systems without enough binary experimental data, GSM model combined with binary Butler equation can also achieve reliable results, which has been applied for predicting the surface tension of SAC305-based quaternary and quinary alloys to guide the design of novel Pb-free solders.
Source: expertdata · Quality: candidate unverified · Source record ↗
Research context
OpenAlex topics: Electronic Packaging and Soldering Technologies · Metallurgical and Alloy Processes · 3D IC and TSV technologies
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
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