journal article·2012-12

Dielectric behavior of organically modified siloxane melting gels

Louis Gambino, Andrei Jitianu, Lisa C. Klein

Journal of Non-Crystalline Solids· Volume 358· Issue 24
Publisher page

Abstract

Abstract Hybrid melting gels were prepared by a sol–gel process, starting with a mono-substituted alkoxysilane and a di-substituted alkoxysilane, methyltriethoxysilane (MTES) together with dimethyldiethoxysilane (DMDES). Five gel compositions were prepared with concentrations between 50% MTES–50% DMDES and 75% MTES–25% DMDES (in mol%). The index of refraction was measured using a Becke line method. The index of refraction decreased slightly as the amount of mono-substituted alkoxysilane decreased. The dielectric constant was determined from impedance spectrometry that followed dielectric constant and dielectric loss as a function of frequency. The dielectric constant was lowest in the 50% MTES–50% DMDES composition at frequencies greater than 1 kHz, around 3.3. Since direct Si C bonds are less polarizable than Si O Si, the di-substituted alkoxysilane component decreases the dielectric constant.
Source: openaire · Quality: candidate unverified · Source record ↗

Research context

OpenAlex topics: Silicone and Siloxane Chemistry · Aerogels and thermal insulation · Synthesis and properties of polymers

SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.

References (21)

Show source-provided references
1. Materials chemistry for low-k materials10.1016/S1369-7021(06)71387-6 ↗
2. Porous dielectrics in microelectronic wiring applications10.3390/ma3010536 ↗
3. Plasma enhanced chemical vapor deposition of low dielectric constant SiOC(H) films using MTES/O2 precursor10.1016/j.tsf.2006.10.036 ↗
4. Influence of thermal treatment of low dielectric constant SiOC(H) films using MTES/O2 deposited by PECVD10.1016/j.apsusc.2007.04.075 ↗
5. Physical properties of low-k films based on the co-condensation of methyltrimethoxysilane with a bridged silsesquioxane10.1007/s10853-006-0575-9 ↗
6. The effect of porogen on physical properties in MTMS–BTMSE spin-on organosilicates10.1007/s10853-006-0886-x ↗
7. Dielectric and mechanical properties of surface modified organosilicate films10.1007/s10971-005-3217-9 ↗
8. Controllable preparation of ultra-low dielectric nanoporous silica via inorganic–organic hybrid templates10.1039/b920893c ↗
9. Latex-templated silica films: tailoring porosity to get a stable low-refractive index10.1021/cm903754k ↗
10. Preparation and characterization of copolymerized methylsilsequioxane–benzylsilsesquioxane microparticles for electrophoretic sol–gel deposition10.1023/B:JMSC.0000012920.25128.1a ↗
11. Microstructures and properties of ORMOSIL comprising methyl, vinyl, and γ-glycidoxypropyl-substituted silica10.1016/j.optmat.2006.08.014 ↗
12. Mechanical enhancement of low-k organosilicates by laser spike annealing10.1149/1.2966222 ↗
13. Single step preparation of novel hydrophobic composite films for low-k applications10.1002/adfm.200701394 ↗
14. Organic–inorganic sol–gel thick films for humidity barriers10.1557/JMR.2008.0283 ↗
15. Phenyl-substituted siloxane hybrid gels that soften below 140°C10.1111/j.1551-2916.2008.02841.x ↗
16. Methyl modified siloxane melting gels for hydrophobic films10.1007/s10971-009-2087-y ↗
17. Preparation of transparent thick films by electrophoretic sol–gel deposition using phenyltriethoxysilane-derived particles10.1111/j.1151-2916.1998.tb02653.x ↗
18. Thermal softening behavior and application to transparent thick films of poly(benzylsilsesquioxane) particles prepared by sol–gel process10.1111/j.1151-2916.2001.tb00740.x ↗
19. Organic–inorganic hybrid melting gels10.1007/s10971-011-2414-y ↗
20. Dielectric breakdown of thinned BaO–Al2O3–B2O3–SiO2 glass10.1111/j.1551-2916.2010.03749.x ↗
21. A. Jitianu, K. Lammers, G.A. Arbuckle-Kiel, L.C. Klein, Thermal analysis of organically modified siloxane melting gels, J. Therm. Anal. Calorim. (in press), doi:10.1007/s10973-011-2024-5.10.1007/s10973-011-2024-5 ↗