journal article·2007-12

Structural evolution in the solidification process of Cu–Sn alloys

Yan Zhao, Xiufang Bian, Jingyu Qin, Xubo Qin, Xiaoxia Hou

Journal of Non-Crystalline Solids· Volume 353· Issue 52-54
Publisher page

Abstract

Abstract The liquid structures in the solidification process of the Cu100−xSnx (x = 10, 20, 30, 40) alloys were investigated by X-ray diffraction method. The results show that the Cu3Sn and quasi Cu3Sn structures exist in the Cu–Sn liquids. Which arouses an obvious structure change indicated by the correlation radius rc at about 900 °C. In addition, the structure change induced by the liquid–solid transition at about 30–40 °C below the liquidus is also observed.
Source: openaire · Quality: candidate unverified · Source record ↗

Research context

OpenAlex topics: Metallic Glasses and Amorphous Alloys · Material Dynamics and Properties · Electronic Packaging and Soldering Technologies

SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.

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