journal article·2014-05

Analysis of the optic/impurity-particle/pad interaction for reduction of scratches formed on optics during pad polishing

Defeng Liao, Jian Wang, Shijie Zhao, Ruiqing Xie, Xianhua Chen, Zhigang Yuan, Bo Zhong, Xi Xu, Shuai Zhang

Publisher page

Abstract

Abstract A model for interactions of a single large impurity particle with the optic and pad during pad-polishing has been developed to detailedly illustrate the scratch formation process. Equations for calculating the normal load applied on the optic by the impurity particle are provided, and the friction between the optic and impurity particle has also been considered in scratch formation. Initiation and evolution of the scratches under the combined effects of the normal and friction forces are illustrated in the model. The most important factors affecting the normal load and thus scratch formation have been analyzed and verified using published experimental results. Based on the model, the implications in reduction of scratch formed on optics during pad polishing have been analyzed.
Source: openaire · Quality: candidate unverified · Source record ↗

Research context

OpenAlex topics: Advanced Surface Polishing Techniques · Metal and Thin Film Mechanics · Integrated Circuits and Semiconductor Failure Analysis

SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.

References (46)

Show source-provided references
1. Influence of subsurface cracks on laser-induced surface damage10.1117/12.523864 ↗
2. Toward deterministic material removal and surface figure during fused silica pad polishing10.1111/j.1551-2916.2010.03607.x ↗
3. Improvement of Surface Figure in the Polyurethane Pad Continuous Polishing Process10.4028/www.scientific.net/AMM.319.107 ↗
4. Evaluating subsurface damage in optical glasses
5. Subsurface damage in optical materials: origin, measurement and removal
6. Optical glass fabrication technology. 2: Relationship between surface roughness and subsurface damage10.1364/AO.26.004677 ↗
7. Lawn · 1993
8. Indentation fracture: principles and applications10.1007/BF00823224 ↗
9. Sub-surface mechanical damage distributions during grinding of fused silica10.1016/j.jnoncrysol.2006.09.012 ↗
10. Surface microroughness of optical glasses under deterministic microgrinding10.1364/AO.35.004448 ↗
11. The effect of certain physical and mechanical properties on the grinding of brittle materials
12. Scratch forensics
13. Effect of rogue particles on the sub-surface damage of fused silica during grinding/polishing10.1016/j.jnoncrysol.2007.11.015 ↗
14. Lai · 2001
15. Luo · 2004
16. Heat and its effects to chemical mechanical polishing10.1016/j.jmatprotec.2005.11.025 ↗
17. Particle Adhesion and Removal in Chemical Mechanical Polishing and Post‐CMP Cleaning10.1149/1.1391989 ↗
18. Bozkaya · 2009
19. Suresh · 2005
20. The Effects of abrasive size distribution in chemical-mechanical polishing: modeling and verification
21. A model for mechanical wear and abrasive particle adhesion during the chemical mechanical polishing process10.1149/1.1346614 ↗
22. Material removal mechanism in chemical mechanical polishing: theory and modeling10.1109/66.920723 ↗
23. A mechanical model for particle motion in the micro-scale abrasion wear test10.1016/j.wear.2004.06.001 ↗
24. Surface integrity of silicon wafers in ultra precision machining10.1007/s00170-005-2508-1 ↗
25. Characteristics of hydrolyzed layer and contamination on fused silica induced during polishing10.1016/j.ceramint.2013.08.121 ↗
26. The effect of HF/NH4F etching on the morphology of surface fractures on fused silica10.1016/j.jnoncrysol.2009.01.037 ↗
27. Effect of load in scratch experiments on soda lime silica glass10.1016/j.jnoncrysol.2012.02.006 ↗
28. Scratching by pad asperities in chemical-mechanical polishing10.1016/j.cirp.2010.03.113 ↗
29. CMP profile simulation using an elastic model based on nonlinear contact analysis
30. A new nonlinear-micro-contact model for single particle in the chemical–mechanical polishing with soft pad
31. Optimal size distribution of CMP slurries for enhanced polishing with minimal defects
32. Effect of particle size of chemical mechanical polishing slurries for enhanced polishing with minimal defects10.1149/1.1393931 ↗
33. Nano-scratch evaluations of copper chemical mechanical polishing10.1016/j.tsf.2012.03.057 ↗
34. Analysis of large particle count in fumed silica slurries and its correlation with scratch defects generated by CMP10.1149/1.2184036 ↗
35. Characterization and reduction of copper chemical mechanical polishing induced scratches
36. Generation of pad debris during oxide CMP process and its role in scratch formation10.1149/1.3551507 ↗
37. Reduction of process defects using a modified set-up for chemical mechanical polishing equipment10.1016/S0167-9317(03)00004-2 ↗
38. Controlling Scratching in Cu Chemical Mechanical Planarization10.1149/1.3121964 ↗
39. CMP pad surface roughness and CMP removal rate
40. Lee · 2004
41. A polishing process for nonlinear optical crystal flats based on an annular polyurethane pad10.1016/j.apsusc.2012.05.047 ↗
42. The synergetic role of pores and grooves of the pad on the scratch formation during STI CMP10.1149/1.3447743 ↗
43. Breaking-In a Pad for Scratch-Free, Cu Chemical-Mechanical Polishing10.1149/1.3545066 ↗
44. Mid-Spatial Frequency Error (PSD-2) of optics induced during CCOS and full-aperture polishing10.2971/jeos.2013.13031 ↗
45. Measurements of slurry film thickness and wafer drag during CMP10.1149/1.1649986 ↗
46. Analysis of scratches formed on oxide surface during chemical mechanical planarization10.1149/1.3265474 ↗