journal article·1999-08

Lead free solder materials In–Sn–Zn system

L.C. Prasad, Y. Xie, A. Mikula

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Abstract

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Research context

OpenAlex topics: Thermodynamic and Structural Properties of Metals and Alloys · Electronic Packaging and Soldering Technologies · Metallurgical and Alloy Processes

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References (16)

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