A percolation treatment of DC hopping conduction
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Abstract
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Research context
OpenAlex topics: Electronic Packaging and Soldering Technologies · Semiconductor materials and devices · Copper Interconnects and Reliability
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References (13)
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6. Morgan · Phil. Mag. · 1971 · 23 · 66110.1080/14786437108216412 ↗
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9. M. H. Cohen, private communication.
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13. R. Jones and W. Schaich, in press.