Influence of glass composition on the kinetics of glass etching and frosting in concentrated HF solutions
Source abstract
Abstract
Abstract During etching of a multicomponent glass in concentrated hydrofluoric acid (HF) solutions, a crust can gradually appear on the glass surface, depending on the chemical etching parameters. This crust deposition is the result of the precipitation of hexafluorosilicate anions released by the glass dissolution reaction, with cations coming either from the etching solution or from the glass (like Na+, K+ or Ca2+). To understand the impact of this crust on the overall kinetics of both the etching and frosting process, we have studied the dissolution of four types of commercial glass substrates in etching solutions containing various concentrations of HF. The kinetics of the frosting process was investigated by two independent methods: on the one hand the chemical analysis by ICP-OES of the amount of Si dissolved from the glass as a function of time, and on the other hand the measurement of the glass weight loss with time. These two methods showed that the glass etching rate decreases with time as a result of crust formation which gradually becomes more protective. Both methods also indicated that increasing the amount of HF in the etching solution increases the etching rate in a non-linear way, and that the etching rate increases with the alumina content of the glass. A separate chemical analysis of the amount of Si present in the crust also revealed that the amount of HF in the etching solution has an impact on the amount of crust deposited on the glass surface. Finally, we have been able to rationalize all these kinetic data based on a semi-empirical quantitative etching and frosting model, allowing to extract a characteristic dissolution and precipitation constant (Kdiss and Kdep), respectively.
Source: openaire · Quality: candidate unverified · Source record ↗
Research context
OpenAlex topics: 3D IC and TSV technologies · Semiconductor materials and devices · Glass properties and applications
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References (25)
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1. Suppression of haze formation on LCD glass and durability of the substrate etched by BHF10.1889/1.1832908 ↗
2. The effect of HF/NH4F etching on the morphology of surface fractures on fused silica10.1016/j.jnoncrysol.2009.01.037 ↗
3. Wet etching of glass for MEMS applications
4. Studies on SiO –SiO bonding with hydrofluoric acid. Room temperature and low stress bonding technique for MEMS10.1016/S0924-4247(99)00246-0 ↗
5. Wet chemical etching of silicate glasses in hydrofluoric acid based solutions10.1007/BF01352182 ↗
6. The frosting of glass by mixtures containing hydrofluoric acid and alkali fluorides10.1111/j.1151-2916.1927.tb16812.x ↗
7. Paradoxical crystalline morphology of frosted glass10.1016/j.jnoncrysol.2004.08.011 ↗
8. A study of the process conditions that lead to an unusual frosted glass
9. A study of the dissolution of SiO in acidic fluoride solutions10.1149/1.2407835 ↗
10. Solubility and dissolution rate of silica in acid fluoride solutions10.1016/j.gca.2009.08.027 ↗
11. Effect of dilute HF solutions on chemical, optical, and mechanical properties of soda-lime-silica glass10.1007/s10853-010-4679-x ↗
12. The dissolution of Na2O-MgO-CaO-SiO2 glass in aqueous HF solutions10.1007/BF01132419 ↗
13. Principles of wet chemical processing in ULSI micro fabrication10.1109/66.75861 ↗
14. A review of the chemical reaction mechanism and kinetics for hydrofluoric acid etching of silicon dioxide for surface micromachining applications10.1016/0040-6090(93)90752-B ↗
15. Compositional effects in the dissolution of multicomponent silicate glasses in aqueous HF solutions10.1007/BF01124681 ↗
16. The etching mechanisms of SiO2 in hydrofluoric acid10.1149/1.2059243 ↗
17. Etching process of SiO2 by HF molecules10.1063/1.479480 ↗
18. Etching mechanism of vitreous silicon dioxide in HF-based solutions10.1021/ja993803z ↗
19. The mechanism of HF/H2O chemical etching of SiO210.1063/1.1420729 ↗
20. Mechanism of the etching rate change of aluminosilicate glass in HF acid with micro-indentation10.1016/j.apsusc.2008.07.085 ↗
21. Micro-fabrication techniques applied to aluminosilicate glass surfaces: micro-indentation and wet etching process10.1016/j.tsf.2008.11.077 ↗
22. Solubility of (NH4)2SiF6, K2SiF6 and Na2SiF6 in acidic solutions10.1016/j.cplett.2006.06.044 ↗
23. Characterization of deep wet etching of glass
24. On the wet etching of Pyrex glass10.1016/j.sna.2007.11.022 ↗
25. Clarke · 1980