Molecular dynamics simulation on elastoplastic properties of the void expansion in nanocrystalline copper
Source abstract
Abstract
Influences of different factors on the elastic-plastic properties of nanocrystalline copper containing a void are studied by the molecular dynamics method. The radius of the circular plate is 30a, while the radius of the void is 5a (a is 0.3615 nm for the lattice constant of bulk copper). The effects of crystal orientation, the void ellipticity, loading rate, and temperature of nanocrystalline copper are discussed. The elastic-plastic deformation of nanocrystalline under inner pressure is investigated in this research. The plastic zone is determined according to the dislocation nucleation from the edge of the void. The simulation results show that there are different deformation mechanisms under different crystal orientations, and the nanocrystalline copper can be strengthened by changing the void shape, decreasing the loading rate, and lowering the temperature. And the plastic zone initiation and growth are further explained. The change of different conditions has a great influence on plastic zone.
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Research context
OpenAlex topics: Microstructure and mechanical properties · Metal Forming Simulation Techniques · Metal and Thin Film Mechanics
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
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