journal article·2025-02Open access

Aerosolized liquid phase reaction method: an approach for the continuous preparation of highly dispersed copper nanoparticles

Guannan Yang, Weiwei He, Wenzhe Wang, Xianhao Da, Shengtao Yu, Qian Xiong, Tianshuo Zhao, Guanghan Huang, Yu Zhang, Chengqiang Cui

Journal of Nanoparticle Research· Volume 27· Issue 2

Abstract

No abstract is available for this record. The assistant can identify its topic from the title, but cannot infer the study’s results.

Source: Not provided · Quality: missing

Research context

OpenAlex topics: Nanocluster Synthesis and Applications · Gold and Silver Nanoparticles Synthesis and Applications · Nanomaterials and Printing Technologies

SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.

References (31)

Show source-provided references
1. Naikoo G, Al-Mashali F, Arshad F et al (2021) An overview of copper nanoparticles: synthesis, characterisation and anticancer activity. Curr Pharm Des 27:4416–443210.2174/1381612827666210804100303 ↗
2. Peng P, Hu A, Gerlich AP, Zou G, Zhou YN (2015) Joining of silver nanomaterials at low temperatures: processes, properties, and applications. Acs Appl Mater Interfaces 7:1259710.1021/acsami.5b02134 ↗
3. Guannan Y, Guangdong X, Quanzhen L et al (2021) Understanding the sintering and heat dissipation behaviours of Cu nanoparticles during low-temperature selective laser sintering process on flexible substrates. J Phys D: Appl Phys 54:37530410.1088/1361-6463/ac0d73 ↗
4. Zhang Y, Cao P, Lin W et al (2021) Synergy effect of mixed sintering accelerator on the deoxidation and sintering property improvement of Cu nanoparticles at low temperature. Appl Phys A-Mater Sci Process 127:78310.1007/s00339-021-04924-9 ↗
5. Hsiao C-H, Kung W-T, Song J-M, Chang J-Y, Chang T-C (2016) Development of Cu-Ag pastes for high temperature sustainable bonding. Mater Sci Eng, A 684:50010.1016/j.msea.2016.12.084 ↗
6. Yan J, Zou G, Lei L et al (2015) Sintering mechanisms and mechanical properties of joints bonded using silver nanoparticles for electronic packaging applications. Weld World 59:42710.1007/s40194-014-0216-x ↗
7. Li W, Li L, Gao Y et al (2018) Highly conductive copper films based on submicron copper particles/copper complex inks for printed electronics: microstructure, resistivity, oxidation resistance, and long-term stability. J Alloys Compd 732:24010.1016/j.jallcom.2017.10.193 ↗
8. Wu Y, Zou G, Wang S, Guo W, Zhang H, Liu L (2024) Interfacial bonding mechanisms of sintered Cu nanoparticles on different metallization surfaces. Surf Interfaces 46:10417310.1016/j.surfin.2024.104173 ↗
9. Pajor-Świerzy A, Szczepanowicz K, Kamyshny A, Magdassi S (2021) Metallic core-shell nanoparticles for conductive coatings and printing. Adv Colloid Interface Sci 299:10257810.1016/j.cis.2021.102578 ↗
10. Yang G, Lai H, Lin W et al (2022) Approaching the structure-property relationship of sintered metal nano/microparticles from the perspective of the agglomerate size effect. Powder Technol 399:11725410.1016/j.powtec.2022.117254 ↗
11. Sunho J, Kyoohee W, Dongjo K et al (2008) Controlling the thickness of the surface oxide layer on Cu nanoparticles for the fabrication of conductive structures by ink-jet printing†. Adv Funct Mater 18:67910.1002/adfm.200700902 ↗
12. Jin R (2014) Atomically precise metal nanoclusters: stable sizes and optical properties. Nanoscale 7:154910.1039/C4NR05794E ↗
13. Jung DS, Koo HY, Wang SE, Park SB, Kang YC (2021) Ultrasonic spray pyrolysis for air-stable copper particles and their conductive films. Acta Mater 206:11656910.1016/j.actamat.2020.116569 ↗
14. Jung DS, Lee HM, Kang YC, Park SB (2011) Air-stable silver-coated copper particles of sub-micrometer size. J Colloid Interface Sci 364:57410.1016/j.jcis.2011.08.033 ↗
15. Workie AB, Ningsih HS, Shih S-J (2023) An comprehensive review on the spray pyrolysis technique: historical context, operational factors, classifications, and product applications. J Anal Appl Pyrolysis 170:10591510.1016/j.jaap.2023.105915 ↗
16. Katiyar JK, Sharma AK, Pandey B (2018) Synthesis of iron-copper alloy using electrical discharge machining. Mater Manuf Process 33:153110.1080/10426914.2018.1424997 ↗
17. El-Aal MA, Seto T (2021) Spark discharge deposition of au/cu nanoparticles for surface-enhanced Raman scattering. Surf Interface Anal 53:82410.1002/sia.6975 ↗
18. Ahasan K, Schnoebelen NJ, Shrotriya P, Kingston TA (2024) Continuous sampling of aerosolized particles using stratified two-phase microfluidics. ACS Sens 9:291510.1021/acssensors.4c00042 ↗
19. Cao KLA, Iskandar F, Tanabe E, Ogi T (2023) Recent advances in the fabrication and functionalization of nanostructured carbon spheres for energy storage applications. Kona Powder Part J 40:19710.14356/kona.2023016 ↗
20. Cao KLA, Ogi T (2025) Advanced carbon sphere-based hybrid materials produced by innovative aerosol process for high-efficiency rechargeable batteries. Energy Storage Mater 74:10390110.1016/j.ensm.2024.103901 ↗
21. Sullivan RC, Boyer-Chelmo H, Gorkowski K, Beydoun H (2020) Aerosol optical tweezers elucidate the chemistry, acidity, phase separations, and morphology of atmospheric microdroplets. Acc Chem Res 53:249810.1021/acs.accounts.0c00407 ↗
22. Ghorbani HR (2014) Chemical synthesis of copper nanoparticles. Orient J Chem 30:80310.13005/ojc/300254 ↗
23. Zhang Y, Yu X, Chen Z et al (2023) Synthesis of imidazole-compound-coated copper nanoparticles with promising antioxidant and sintering properties. Micromachines (Basel) 14:207910.3390/mi14112079 ↗
24. Ghorbani HR (2014) Biological and non-biological methods for fabrication of copper nanoparticles. Chem Eng Commun 202:146310.1080/00986445.2014.950732 ↗
25. Zhang Y, Liu Q, Liu Y et al (2022) Green synthesis of novel in situ micro/submicron-Cu paste for semiconductor interconnection. Nanotechnology 33:28570510.1088/1361-6528/ac4b79 ↗
26. Din MI, Arshad F, Hussain Z, Mukhtar M (2017) Green adeptness in the synthesis and stabilization of copper nanoparticles: catalytic, antibacterial, cytotoxicity, and antioxidant activities. Nanoscale Res Lett 12:63810.1186/s11671-017-2399-8 ↗
27. Yang G, Zeng X, Wang P et al (2020) Size refinement of copper nanoparticles: a perspective from electrochemical nucleation and growth mechanism. ChemElectroChem 8:81910.1002/celc.202001534 ↗
28. Yokoyama S, Nozaki J, Umemoto Y, Motomiya K, Itoh T, Takahashi H (2021) Flexible and adhesive sintered Cu nanomaterials on polyimide substrates prepared by combining Cu nanoparticles and nanowires with polyvinylpyrrolidone. Colloids Surf Physicochem Eng Aspects 625:12690710.1016/j.colsurfa.2021.126907 ↗
29. Zhang Y, Liu Q, Liu Y et al (2022) Green synthesis of novel in-situ micro/submicron-Cu paste for semiconductor interconnection. Nanotechnology 33:28570510.1088/1361-6528/ac4b79 ↗
30. Zhang Y, Yu X, Chen Z et al (2023) Synthesis of imidazole-compound-coated copper nanoparticles with promising antioxidant and sintering properties. Micromachines 14:207910.3390/mi14112079 ↗
31. Guannan Y, Haiqi L, Wei L et al (2022) Approaching the structure-property relationship of sintered metal nano/microparticles from the perspective of the agglomerate size effect. Powder Technol 399:11725410.1016/j.powtec.2022.117254 ↗