High-temperature stability of copper nanoparticles through Cu@Ag nanostructures
Source abstract
Abstract
Copper nanoparticles are promising materials for the development of low-cost, low-temperature processable materials for the interconnection technology. Owing to its low price, copper is expected to replace silver in many applications; however, it suffers from its proneness to oxidation, in particular for nanoparticles due to the high surface-to-volume ratio. In this study, we report the synthesis and the characterization by SEM, TEM-EDS, XRD, and TGA of several Cu-based core-shell nanoparticles. We show that their thermal stability in air towards oxidation can be highly enhanced thanks to a simple core–shell fabrication process. Best results were obtained with thermally post-treated 6-nm-silver-thick shells, which allow to improve the oxidation onset temperature up to 206 °C.
Source: openaire · Quality: candidate unverified · Source record ↗
Research context
OpenAlex topics: Nanomaterials and Printing Technologies · Nanomaterials for catalytic reactions · Copper Interconnects and Reliability
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
References (42)
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