Optimal design of coating material for nanoparticles and its application for low-temperature interconnection
Source abstract
Abstract
Metal nanoparticles need coating material so as to avoid aggregating to each other. On the contrary, there are occasions when the coating materials are required to be removed. Here, a theoretical model to relate removability of coating materials to their molecular structure is suggested. The model is used to find an optimum coating material, secondary amine, for use in low-temperature interconnection material. An interconnection made of methyloctylamine-coated silver nanoparticles was formed between a pair of copper electrodes by heating and pressurizing the nanoparticles and electrodes at 250 °C and 2.5 MPa, respectively, for 150 s. Shear strength and thermal conductivity of the formed interconnection were 17.8 MPa and 219 W/mK, respectively. This thermal conductivity value is greater than that obtained using Pb–Sn and silver solders.
Source: openaire · Quality: candidate unverified · Source record ↗
Research context
OpenAlex topics: Electronic Packaging and Soldering Technologies · Semiconductor materials and devices · Molecular Junctions and Nanostructures
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
References (23)
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