Formulation of a paste for copper thick film
Source abstract
Abstract
Conductive copper paste is a promising material for use in electronic devices, replacing silver or other metal pastes, because of its high conductivity, low electro-migration, and cost. However, the high sintering temperature and the need of an inert sintering atmosphere limit the commercial application of copper paste. In this study, a copper thick film paste for use on alumina was developed using a mixture of copper nanoparticles (50 nm in size) and microparticles (1 μm in size). With this paste, the sintering temperature was as low as 500 °C when the pressure was at ambient pressure. It was found that the bimodal copper film offered the best volume resistivity of 6.26 × 10−8 Ω·m at a weight ratio of micro- to nanoparticles of 2:1. Glass frits were used as an additive to improve the adhesion strength between the copper film and the alumina substrate with minimal change in electrical performance.
Source: openaire · Quality: candidate unverified · Source record ↗
Research context
OpenAlex topics: Advanced Sensor and Energy Harvesting Materials · Conducting polymers and applications · Nanomaterials and Printing Technologies
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
References (44)
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