journal article·2013-12

Synthesis and characterization of air-stable Cu nanoparticles for conductive pattern drawing directly on paper substrates

Wei Li, Minfang Chen, Jun Wei, Wenjiang Li, Chen You

Journal of Nanoparticle Research· Volume 15· Issue 12
Publisher page

Abstract

Air-stable Cu nanoparticles (NPs) with an average diameter of 6.5 nm were synthesized under ambient conditions using polyvinylpyrrolidone and cetyltrimethylammonium bromide as a mixed capping agent, for preparing nano-Cu ink applicable for direct writing on photo paper using a roller pen. The size, morphology, and air-stability of the Cu NPs were characterized by TEM, SEM, XRD, etc. The mixed capping agent was effective in reducing the aggregation, size of the Cu NPs and improving their air-stability. The reduced size and enhanced air-stability of the Cu NPs resulted in an improved particle density upon sintering, which was mainly responsible for the increased conductivity of the Cu patterns. The resistivity of Cu patterns sintered at 160 °C for 2 h was 11 ± 0.8 μΩ cm, 6.40 times the bulk resistivity. A sample RFID antenna and a decorative logo were successfully made and the Cu patterns or lines exhibited excellent integrity and good conductivity, which were experimentally tested.
Source: openaire · Quality: candidate unverified · Source record ↗

Research context

OpenAlex topics: Nanomaterials and Printing Technologies · Electrohydrodynamics and Fluid Dynamics · Advanced Sensor and Energy Harvesting Materials

SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.

References (31)

Show source-provided references
1. Buffat P, Borel JP (1976) Size effect on the melting temperature of gold particles. Phys Rev A 13:2287–229810.1103/PhysRevA.13.2287 ↗
2. Chen Y, Au J, Kazlas P, Ritenour A, Gates H, McCreary M (2003) Flexible active-matrix electronic ink display. Nature 423:136–13710.1038/423136a ↗
3. Han WS, Hong JM, Kim HS, Song YW (2011) Multi-pulsed white light sintering of printed Cu nanoinks. Nanotechnology 22:39570510.1088/0957-4484/22/39/395705 ↗
4. Huaman JLC, Sato K, Kurita S, Matsumoto T, Jeyadevan B (2011) Copper nanoparticles synthesized by hydroxyl ion assisted alcohol reduction for conducting ink. J Mater Chem 21:7062–706910.1039/c0jm04470a ↗
5. Hwang HJ, Chung WH, Kim HS (2012) In situ monitoring of flash-light sintering of copper nanoparticle ink for printed electronics. Nanotechnology 23:48520510.1088/0957-4484/23/48/485205 ↗
6. Jensen GC, Krause CE, Sotzing GA, Rusling JF (2011) Inkjet-printed gold nanoparticle electrochemical arrays on plastic. Application to immunodetection of a cancer biomarker protein. Phys Chem Chem Phys 13:4888–489410.1039/c0cp01755h ↗
7. Jeong S, Woo K, Kim D, Lim S, Kim JS, Shin H, Xia Y, Moon J (2008) Controlling the thickness of the surface oxide layer on Cu nanoparticles for the fabrication of conductive structures by ink-jet printing. Adv Funct Mater 18:679–68610.1002/adfm.200700902 ↗
8. Jeong S, Song HC, Lee WW, Lee SS, Choi Y, Son W, Kim ED, Paik CH, Oh SH, Ryu BH (2011) Stable aqueous based Cu nanoparticle ink for printing well-defined highly conductive features on a plastic substrate. Langmuir 27:3144–314910.1021/la104136w ↗
9. Joshi SS, Patil SF, Iyer V, Mahumuni S (1998) Radiation induced synthesis and characterization of copper nanoparticles. Nanostruct Mater 10:1135–114410.1016/S0965-9773(98)00153-6 ↗
10. Kim HS, Dhage SR, Shim DE, Hahn HT (2009) Intense pulsed light sintering of copper nanoink for printed electronics. Appl Phys A 97:791–79810.1007/s00339-009-5360-6 ↗
11. Lisiecki I, Billoudet F, Pileni MP (1996) Control of the shape and the size of copper metallic particles. J Phys Chem 100:4160–416610.1021/jp9523837 ↗
12. Michael G, Alexander K, Shlomo M (2009) Formation of air-stable copper–silver core–shell nanoparticles for inkjet printing. J Mater Chem 19:3057–306210.1039/b821327e ↗
13. Okimoto H, Takenobu T, Yanagi K, Miyata Y, Shimotani H, Kataura H, Iwasa Y (2010) Tunable carbon nanotube thin-film transistors produced exclusively via inkjet printing. Adv Mater 22:3981–398610.1002/adma.201000889 ↗
14. Otte K, Makhova L, Braun A, Konovalov I (2006) Flexible Cu (In, Ga) Se2 thin-film solar cells for space application. Thin Solid Films 511:613–62210.1016/j.tsf.2005.11.068 ↗
15. Park BK, Kim D, Jeong S, Moon J, Kim JS (2007a) Direct writing of copper conductive patterns by ink-jet printing. Thin Solid Films 515:7706–771110.1016/j.tsf.2006.11.142 ↗
16. Park BK, Jeong S, Kim D, Moon J, Lim S, Kim JS (2007b) Synthesis and size control of monodisperse copper nanoparticles by polyol method. J Colloid Interface Sci 311:417–42410.1016/j.jcis.2007.03.039 ↗
17. Russo A, Ahn BY, Adams JJ, Duoss EB, Bernhard JT, Lewis JA (2011) Pen-on-paper flexible electronics. Adv Mater 23:3426–343010.1002/adma.201101328 ↗
18. Ryu J, Kim HS, Hahn HT (2011) Reactive sintering of copper nanoparticles using intense pulsed light for printed electronics. J Electron Mater 40:42–5010.1007/s11664-010-1384-0 ↗
19. Samarasinghe SR, Santos IP, Edirisinghe MJ, Reece MJ, Liz-Marzán LM (2006) Printing gold nanoparticles with an electrohydrodynamic direct-write device. Gold Bull 39:48–5310.1007/BF03215276 ↗
20. Siegel AC, Phillips ST, Wiley BJ, Whitesides GM (2009) Thin, lightweight, foldable thermochromic displays on paper. Lab Chip 9:2775–278110.1039/b905832j ↗
21. Siegel AC, Phillips ST, Dickey MD, Lu N, Suoand Z, Whitesides GM (2010) Foldable printed circuit boards on paper substrates. Adv Funct Mater 20:25–2810.1002/adfm.200901363 ↗
22. Singh M, Haverinen HM, Dhagat P, Jabbour GE (2010) Inkjet printing: process and its applications. Adv Mater 22:673–68510.1002/adma.200901141 ↗
23. Sui ZM, Chen X, Wang LY, Xu LM, Zhuang WC, Chai YC, Yang CJ (2006) Capping effect of CTAB on positively charged Ag nanoparticles. Physica E 33:308–31410.1016/j.physe.2006.03.151 ↗
24. Tai YL, Yang ZG (2011) Fabrication of paper-based conductive patterns for flexible electronics by direct-writing. J Mater Chem 21:5938–594310.1039/c0jm03065a ↗
25. Tang XF, Yang ZG, Wang WJ (2010) A simple way of preparing high-concentration and high-purity nano copper colloid for conductive ink in inkjet printing technology. Colloids Surf A 360:99–10410.1016/j.colsurfa.2010.02.011 ↗
26. Wang HS, Qiao XL, Chen JG, Wang XJ, Ding SY (2005) Mechanisms of PVP in the preparation of silver nanoparticles. Mater Chem Phys 94:449–45310.1016/j.matchemphys.2005.05.005 ↗
27. Wu SH, Chen DH (2004) Synthesis of high-concentration Cu nanoparticles in aqueous CTAB solutions. J Colloid Interface Sci 273:165–16910.1016/j.jcis.2004.01.071 ↗
28. Yan JF, Zou GS, Hu AM, Zhou YN (2011) Preparation of PVP coated Cu NPs and the application for low-temperature bonding. J Mater Chem 21:15981–1598610.1039/c1jm12108a ↗
29. Yanase A, Komiyama H (1991) In situ observation of oxidation and reduction of small supported. Surf Sci 248:11–1910.1016/0039-6028(91)90056-X ↗
30. Zhang ZL, Zhang XG, Xin ZG, Deng MM, Wen YQ, Song YL (2011) Synthesis of monodisperse silver nanoparticles for ink-jet printed flexible electronics. Nanotechnology 22:42560110.1088/0957-4484/22/42/425601 ↗
31. Zheng N, Fan J, Stucky GD (2007) One-step one-phase synthesis of monodisperse noble-metallic nanoparticles and their colloidal crystals. J Am Chem Soc 128:6550–655110.1021/ja0604717 ↗