In-situ surface modification of nickel mesh for superior electromagnetic interference shielding

Metal mesh, with its inherent conductivity, transparency, and flexibility, has proven to be an exceptional choice for high-performance reflection-dominated electromagnetic interference (EMI) shielding materials, due to its multifunctionality and wide applicability. However, the development of metal-based absorption-enhanced EMI shielding materials characterized by high absorption and low reflection is crucial but remains challenging. Herein, we introduce a novel surface modification strategy for nickel mesh (NM) aimed at augmenting its surface electromagnetic wave absorption through electrochemical surface microstructure alteration and subsequent wet chemical sulphuration. This approach leverages the multiple reflections within the microporous structure and the impedance matching enhancement provided by the magnetic sulfided nickel layer, resulting in the sulphur-treated porous NM (Ni3S2-PNM) achieving an outstanding average EMI SE of 59.6 dB across a broad frequency range of 4 to 40 GHz. The surface electromagnetic wave absorption rate of Ni3S2-PNM has increased from under 1% for unmodified NM to over 60%, significantly reducing the re-reflection of electromagnetic waves back into free space (the average SER value decreases from about 20 dB to 2.2 dB). Characterized by its simplicity and cost-effectiveness, this in-situ surface modification method on bulk industrial-grade NM, enhancing electromagnetic shielding, presents a promising avenue for wider application in electromagnetic protection.